JPS5689067A - Method for inspecting wiring substrate - Google Patents
Method for inspecting wiring substrateInfo
- Publication number
- JPS5689067A JPS5689067A JP16665979A JP16665979A JPS5689067A JP S5689067 A JPS5689067 A JP S5689067A JP 16665979 A JP16665979 A JP 16665979A JP 16665979 A JP16665979 A JP 16665979A JP S5689067 A JPS5689067 A JP S5689067A
- Authority
- JP
- Japan
- Prior art keywords
- wiring substrate
- inspection
- check
- conduction states
- states
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
PURPOSE: To reduce inspection time by dividing the multiple inspection terminals of a wiring substrate to a pluraity of inspection terminal groups, and comparing the conduction states thereof and the conduction states of a normal wiring substrate having beforehand been stroed thereby detecting disconnection and short-circuiting.
CONSTITUTION: Multiple check pins provide to a wiring substrate 40 are divided to plural check pin groups 60, each group consisting of a fixed number of check pins. The conduction state between respective check pins is checked with a normal viring substrate 41, and these conduction states are stored for every check pin group 30, in a storage device 50. The conduction states of the wiring substrate 40 are detected through the check pin groups 30 connected via an interface 20 by a microcomputer 10, and said states and the conduction states having been stored in the storage device 50 are compared, whereby the decision of acceptance or rejection is accomplished. Hence, emphasis is placed on the checking of accetance or rejection, whereby the number of inspection times is reduced and the reliable inspection may be carried out.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16665979A JPS5689067A (en) | 1979-12-20 | 1979-12-20 | Method for inspecting wiring substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16665979A JPS5689067A (en) | 1979-12-20 | 1979-12-20 | Method for inspecting wiring substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5689067A true JPS5689067A (en) | 1981-07-20 |
Family
ID=15835351
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16665979A Pending JPS5689067A (en) | 1979-12-20 | 1979-12-20 | Method for inspecting wiring substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5689067A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5766367A (en) * | 1980-10-13 | 1982-04-22 | Shonan Eng Kk | Inspection apparatus for printed board |
JPS61104387U (en) * | 1984-12-14 | 1986-07-02 |
-
1979
- 1979-12-20 JP JP16665979A patent/JPS5689067A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5766367A (en) * | 1980-10-13 | 1982-04-22 | Shonan Eng Kk | Inspection apparatus for printed board |
JPS61104387U (en) * | 1984-12-14 | 1986-07-02 | ||
JPH0422307Y2 (en) * | 1984-12-14 | 1992-05-21 |
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