JPS5688344A - Heat dissipating plate for semiconductor - Google Patents

Heat dissipating plate for semiconductor

Info

Publication number
JPS5688344A
JPS5688344A JP16639779A JP16639779A JPS5688344A JP S5688344 A JPS5688344 A JP S5688344A JP 16639779 A JP16639779 A JP 16639779A JP 16639779 A JP16639779 A JP 16639779A JP S5688344 A JPS5688344 A JP S5688344A
Authority
JP
Japan
Prior art keywords
plate
heat dissipating
enamel
semiconductor
steel plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16639779A
Other languages
Japanese (ja)
Other versions
JPS6115586B2 (en
Inventor
Kikuo Wakino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP16639779A priority Critical patent/JPS5688344A/en
Publication of JPS5688344A publication Critical patent/JPS5688344A/en
Publication of JPS6115586B2 publication Critical patent/JPS6115586B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To increase the mechanical strength and the heat insulating property of the heat dissipating plate for a semiconductor by providing a coolant passage in the plate using a steel plate covered with enamel. CONSTITUTION:After the steel plate 1 having a passage 2 is cleaned, the plate is rinsed with acidic solution and is thus roughed on the surface. After the plate is cleaned, the plate is plated with Ni, is adhered with aqueous solution containing enamel as a main ingredient, is dried and is baked. Since a core material is formed of the steel plate according to this construction, it has high strength and high heat insulating property. Since it is covered with enamel, it has preferable electric insulation and preferable thermal properties. Thus, there can be obtained the heat dissipating plate having large size and high durability.
JP16639779A 1979-12-20 1979-12-20 Heat dissipating plate for semiconductor Granted JPS5688344A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16639779A JPS5688344A (en) 1979-12-20 1979-12-20 Heat dissipating plate for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16639779A JPS5688344A (en) 1979-12-20 1979-12-20 Heat dissipating plate for semiconductor

Publications (2)

Publication Number Publication Date
JPS5688344A true JPS5688344A (en) 1981-07-17
JPS6115586B2 JPS6115586B2 (en) 1986-04-24

Family

ID=15830652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16639779A Granted JPS5688344A (en) 1979-12-20 1979-12-20 Heat dissipating plate for semiconductor

Country Status (1)

Country Link
JP (1) JPS5688344A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5863794U (en) * 1981-10-24 1983-04-28 住友軽金属工業株式会社 main heat sink
US4690855A (en) * 1983-12-28 1987-09-01 Kawasaki Steel Corporation Substrate for print circuit board, a print circuit board, and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5863794U (en) * 1981-10-24 1983-04-28 住友軽金属工業株式会社 main heat sink
US4690855A (en) * 1983-12-28 1987-09-01 Kawasaki Steel Corporation Substrate for print circuit board, a print circuit board, and method of manufacturing the same

Also Published As

Publication number Publication date
JPS6115586B2 (en) 1986-04-24

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