JPS5683049A - Inspection of airtightness of semiconductor device - Google Patents
Inspection of airtightness of semiconductor deviceInfo
- Publication number
- JPS5683049A JPS5683049A JP16314479A JP16314479A JPS5683049A JP S5683049 A JPS5683049 A JP S5683049A JP 16314479 A JP16314479 A JP 16314479A JP 16314479 A JP16314479 A JP 16314479A JP S5683049 A JPS5683049 A JP S5683049A
- Authority
- JP
- Japan
- Prior art keywords
- airtightness
- semiconductor device
- gas
- radiation
- held
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/22—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device liquid at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/20—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device gaseous at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16314479A JPS5683049A (en) | 1979-12-11 | 1979-12-11 | Inspection of airtightness of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16314479A JPS5683049A (en) | 1979-12-11 | 1979-12-11 | Inspection of airtightness of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5683049A true JPS5683049A (en) | 1981-07-07 |
Family
ID=15768045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16314479A Pending JPS5683049A (en) | 1979-12-11 | 1979-12-11 | Inspection of airtightness of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5683049A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57197469A (en) * | 1981-05-29 | 1982-12-03 | Sekisui Chem Co Ltd | Vessel for blood inspection |
EP3933907A1 (en) * | 2020-06-30 | 2022-01-05 | ABB Schweiz AG | Power semiconductor device |
-
1979
- 1979-12-11 JP JP16314479A patent/JPS5683049A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57197469A (en) * | 1981-05-29 | 1982-12-03 | Sekisui Chem Co Ltd | Vessel for blood inspection |
JPS6367857B2 (ja) * | 1981-05-29 | 1988-12-27 | Sekisui Chemical Co Ltd | |
EP3933907A1 (en) * | 2020-06-30 | 2022-01-05 | ABB Schweiz AG | Power semiconductor device |
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