JPS5681952A - Microscopic wiring structure - Google Patents
Microscopic wiring structureInfo
- Publication number
- JPS5681952A JPS5681952A JP15802379A JP15802379A JPS5681952A JP S5681952 A JPS5681952 A JP S5681952A JP 15802379 A JP15802379 A JP 15802379A JP 15802379 A JP15802379 A JP 15802379A JP S5681952 A JPS5681952 A JP S5681952A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wiring
- intermediate layer
- sio2
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To obtain the highly reliable microscopic wiring by a method wherein the wiring made of the alloy having the principal ingredient of Al containing Cu is covered by the intermediate layer which does not contain SiO2 and Cu, and an SiO2 insulating layer or the insulating layer having the SiO2 as the principal ingredient is superposed on said intermediate layer. CONSTITUTION:A wiring layer 22 is formed by evaporating about 1mum of Al-Cu alloy containing 3.5wt% of Cu on the Si substrate 21. Then the Si substrate is soaked in a nitric acid aqueous solution of 64wt% and the Cu on its surface is eluted and an intermediate layer 24 that contains no Cu is formed. The intermediate layer is a thin film of Al and its thickness is about 20-300mum. Ti, W, Mo, Al-Si alloy, Al2O3 and Si3N4 may be used as an intermediate layer besides Al. Then PSG23, containing 4.5mol% of P2O5, is laminated about 700mum using a CVD method. In this constitution, the direct contact of the Al alloy wiring with the SiO2 or the PSG layer is completely prevented except at the lower surface of the wiring layer and no defect is generated on said contact surface at the temperature of 350-450 deg.C.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15802379A JPS5951747B2 (en) | 1979-12-07 | 1979-12-07 | Micro wiring structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15802379A JPS5951747B2 (en) | 1979-12-07 | 1979-12-07 | Micro wiring structure |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5681952A true JPS5681952A (en) | 1981-07-04 |
JPS5951747B2 JPS5951747B2 (en) | 1984-12-15 |
Family
ID=15662578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15802379A Expired JPS5951747B2 (en) | 1979-12-07 | 1979-12-07 | Micro wiring structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5951747B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4559277A (en) * | 1983-06-17 | 1985-12-17 | Ngk Spark Plug Co., Ltd. | Ceramic and aluminum alloy composite |
JPH02296334A (en) * | 1989-04-17 | 1990-12-06 | Internatl Business Mach Corp <Ibm> | Wiring structure and its formation method |
-
1979
- 1979-12-07 JP JP15802379A patent/JPS5951747B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4559277A (en) * | 1983-06-17 | 1985-12-17 | Ngk Spark Plug Co., Ltd. | Ceramic and aluminum alloy composite |
JPH02296334A (en) * | 1989-04-17 | 1990-12-06 | Internatl Business Mach Corp <Ibm> | Wiring structure and its formation method |
Also Published As
Publication number | Publication date |
---|---|
JPS5951747B2 (en) | 1984-12-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0092020A3 (en) | Composite structure, particularly for use as a printed-circuit board | |
JPS5522704A (en) | Multilayer antireflecting film | |
JPS5681952A (en) | Microscopic wiring structure | |
JPS5689702A (en) | Laser beam reflecting mirror | |
FR2409660A1 (en) | PRINTED CIRCUIT SUBSTRATE WITH RESISTANT COATING | |
SU714508A1 (en) | Composition for metallization of thick-film integrated microcircuits | |
JPS57192846A (en) | Humidity sensor and manufacture thereof | |
SE7903711L (en) | SET AND BATH FOR PLATING | |
JPS5754282A (en) | Surface treatment of heat resistant alloy | |
JPS5484932A (en) | Forming method of multi-layer construction | |
JPS6476610A (en) | Superconductive composite material | |
JPS5752590A (en) | Au alloy brazing filler metal of low melting point | |
JPS5764319A (en) | Magnetic head and its manufacture | |
JPS5516425A (en) | Semiconductor device | |
JPS6468996A (en) | Metal thin film and formation thereof | |
JPS6421943A (en) | Semiconductor device | |
JPS57115864A (en) | Compound semiconductor device | |
JPS54118345A (en) | Metal lift off process | |
MITSUHIRO et al. | Ohmic electrode forming method in compound semiconductor | |
JPS56169774A (en) | Outside parts of watch | |
JPS57139942A (en) | Manufacture of semiconductor device | |
RU1464831C (en) | Contact system for photoelectric transducers | |
Reznichenko et al. | Study of the Surface State of Chemically Treated Aluminum Foil.(Translation) | |
JPS56169363A (en) | Semiconductor device | |
Muhlratzer et al. | Metallic Component With Corrosion-Resistant Oxidic Coating Applied to Opposite Sides |