JPS5681952A - Microscopic wiring structure - Google Patents

Microscopic wiring structure

Info

Publication number
JPS5681952A
JPS5681952A JP15802379A JP15802379A JPS5681952A JP S5681952 A JPS5681952 A JP S5681952A JP 15802379 A JP15802379 A JP 15802379A JP 15802379 A JP15802379 A JP 15802379A JP S5681952 A JPS5681952 A JP S5681952A
Authority
JP
Japan
Prior art keywords
layer
wiring
intermediate layer
sio2
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15802379A
Other languages
Japanese (ja)
Other versions
JPS5951747B2 (en
Inventor
Yoshio Honma
Hisao Nozawa
Yukiyoshi Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15802379A priority Critical patent/JPS5951747B2/en
Publication of JPS5681952A publication Critical patent/JPS5681952A/en
Publication of JPS5951747B2 publication Critical patent/JPS5951747B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To obtain the highly reliable microscopic wiring by a method wherein the wiring made of the alloy having the principal ingredient of Al containing Cu is covered by the intermediate layer which does not contain SiO2 and Cu, and an SiO2 insulating layer or the insulating layer having the SiO2 as the principal ingredient is superposed on said intermediate layer. CONSTITUTION:A wiring layer 22 is formed by evaporating about 1mum of Al-Cu alloy containing 3.5wt% of Cu on the Si substrate 21. Then the Si substrate is soaked in a nitric acid aqueous solution of 64wt% and the Cu on its surface is eluted and an intermediate layer 24 that contains no Cu is formed. The intermediate layer is a thin film of Al and its thickness is about 20-300mum. Ti, W, Mo, Al-Si alloy, Al2O3 and Si3N4 may be used as an intermediate layer besides Al. Then PSG23, containing 4.5mol% of P2O5, is laminated about 700mum using a CVD method. In this constitution, the direct contact of the Al alloy wiring with the SiO2 or the PSG layer is completely prevented except at the lower surface of the wiring layer and no defect is generated on said contact surface at the temperature of 350-450 deg.C.
JP15802379A 1979-12-07 1979-12-07 Micro wiring structure Expired JPS5951747B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15802379A JPS5951747B2 (en) 1979-12-07 1979-12-07 Micro wiring structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15802379A JPS5951747B2 (en) 1979-12-07 1979-12-07 Micro wiring structure

Publications (2)

Publication Number Publication Date
JPS5681952A true JPS5681952A (en) 1981-07-04
JPS5951747B2 JPS5951747B2 (en) 1984-12-15

Family

ID=15662578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15802379A Expired JPS5951747B2 (en) 1979-12-07 1979-12-07 Micro wiring structure

Country Status (1)

Country Link
JP (1) JPS5951747B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4559277A (en) * 1983-06-17 1985-12-17 Ngk Spark Plug Co., Ltd. Ceramic and aluminum alloy composite
JPH02296334A (en) * 1989-04-17 1990-12-06 Internatl Business Mach Corp <Ibm> Wiring structure and its formation method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4559277A (en) * 1983-06-17 1985-12-17 Ngk Spark Plug Co., Ltd. Ceramic and aluminum alloy composite
JPH02296334A (en) * 1989-04-17 1990-12-06 Internatl Business Mach Corp <Ibm> Wiring structure and its formation method

Also Published As

Publication number Publication date
JPS5951747B2 (en) 1984-12-15

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