JPS5681679A - Plating method for protecting side face of pattern plated copper - Google Patents
Plating method for protecting side face of pattern plated copperInfo
- Publication number
- JPS5681679A JPS5681679A JP15812779A JP15812779A JPS5681679A JP S5681679 A JPS5681679 A JP S5681679A JP 15812779 A JP15812779 A JP 15812779A JP 15812779 A JP15812779 A JP 15812779A JP S5681679 A JPS5681679 A JP S5681679A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- upper layer
- lower layer
- plated
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 6
- 229910052802 copper Inorganic materials 0.000 title abstract 6
- 239000010949 copper Substances 0.000 title abstract 6
- 238000000034 method Methods 0.000 title abstract 2
- 238000007747 plating Methods 0.000 title abstract 2
- 239000011347 resin Substances 0.000 abstract 7
- 229920005989 resin Polymers 0.000 abstract 7
- 239000002904 solvent Substances 0.000 abstract 3
- 125000003277 amino group Chemical group 0.000 abstract 1
- 229940114081 cinnamate Drugs 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 abstract 1
- -1 orthoquinone azide Chemical class 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 abstract 1
- 229920002554 vinyl polymer Polymers 0.000 abstract 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15812779A JPS5681679A (en) | 1979-12-07 | 1979-12-07 | Plating method for protecting side face of pattern plated copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15812779A JPS5681679A (en) | 1979-12-07 | 1979-12-07 | Plating method for protecting side face of pattern plated copper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5681679A true JPS5681679A (en) | 1981-07-03 |
| JPS6233316B2 JPS6233316B2 (enrdf_load_stackoverflow) | 1987-07-20 |
Family
ID=15664871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15812779A Granted JPS5681679A (en) | 1979-12-07 | 1979-12-07 | Plating method for protecting side face of pattern plated copper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5681679A (enrdf_load_stackoverflow) |
-
1979
- 1979-12-07 JP JP15812779A patent/JPS5681679A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6233316B2 (enrdf_load_stackoverflow) | 1987-07-20 |
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