JPS5679443A - Detection of brazing layer defect in semiconductor device - Google Patents

Detection of brazing layer defect in semiconductor device

Info

Publication number
JPS5679443A
JPS5679443A JP15937479A JP15937479A JPS5679443A JP S5679443 A JPS5679443 A JP S5679443A JP 15937479 A JP15937479 A JP 15937479A JP 15937479 A JP15937479 A JP 15937479A JP S5679443 A JPS5679443 A JP S5679443A
Authority
JP
Japan
Prior art keywords
liquid
brazing layer
semiconductor device
color check
immersed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15937479A
Other languages
Japanese (ja)
Inventor
Kazuya Urakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15937479A priority Critical patent/JPS5679443A/en
Publication of JPS5679443A publication Critical patent/JPS5679443A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To provide a nondestructive efficient detection of faulty parts of the semiconductor device by a method wherein a color check liquid is coated on a surface of the brazing layer in the semiconductor device having a semiconductor wafer and a supporting plate brazed with each other, and oozing of the color check liquid in the surface is utilized to detect the presence of voids in the semiconductor. CONSTITUTION:Semiconductor wafer 2 is fixed to the supporting plate 1 via a brazing layer 3, a color check liquid A 6 is coated on the surface of the brazing layer 3 and immersed therein. Then, in this condition, it is kept as it is for a period longer than thirty minutes, and the remained liquid A 6 on the surface is cleaned with water or wiped off clearly with cloths, a color check liquid B 7 is coated on the surface thereof so as to make the immersed liquid A 6 distinguishable and then similarly left as it is for more than ten minutes. In this way, the liquid A 6 immersed in the void 5 in the layer 3 is absorbed into the liquid B 7 under a capillary action, and the obtained discoloring shows the presence of voids. Red immersion liquid is used as the liquid A 6 and white liquid is used as the liquid B 7 to be solidified after coating.
JP15937479A 1979-12-03 1979-12-03 Detection of brazing layer defect in semiconductor device Pending JPS5679443A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15937479A JPS5679443A (en) 1979-12-03 1979-12-03 Detection of brazing layer defect in semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15937479A JPS5679443A (en) 1979-12-03 1979-12-03 Detection of brazing layer defect in semiconductor device

Publications (1)

Publication Number Publication Date
JPS5679443A true JPS5679443A (en) 1981-06-30

Family

ID=15692420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15937479A Pending JPS5679443A (en) 1979-12-03 1979-12-03 Detection of brazing layer defect in semiconductor device

Country Status (1)

Country Link
JP (1) JPS5679443A (en)

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