JPS5676551A - Transistor mount - Google Patents
Transistor mountInfo
- Publication number
- JPS5676551A JPS5676551A JP15320279A JP15320279A JPS5676551A JP S5676551 A JPS5676551 A JP S5676551A JP 15320279 A JP15320279 A JP 15320279A JP 15320279 A JP15320279 A JP 15320279A JP S5676551 A JPS5676551 A JP S5676551A
- Authority
- JP
- Japan
- Prior art keywords
- fet
- manner
- heat
- insulating sheet
- shielding case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
PURPOSE:To insulating an FET in a DC manner and conduct the heat sink of the FET in an AC manner by interposing an insulating sheet between a metal for shielding and dissipating heat and a heat sink mounting plate and providing an electromagnetic absorber thereat. CONSTITUTION:A source-grounding type FET4 and both substrates 21, 26 are fixed on a heat conductive source mounting palte 31, which is fixed by screws 33, 34 insulated through a thin insulating sheet 32 from a shielding case 23. an electromagnetic wave absorbers 41, 42 are buried in a rectangular cross sectional groove at the bottom of the source mounting plate 31. Thus, the heat of the FET is dissipated through the thin insulating sheet 32 to the shielding case, is insulated in a DC manner and is ground to the shielding case in an AC manner. The feedback between the input and the output of the FET can be suppressed by absorbing the electromagnetic wave through a gap due to the absorber.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15320279A JPS6033310B2 (en) | 1979-11-26 | 1979-11-26 | transistor mount |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15320279A JPS6033310B2 (en) | 1979-11-26 | 1979-11-26 | transistor mount |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5676551A true JPS5676551A (en) | 1981-06-24 |
JPS6033310B2 JPS6033310B2 (en) | 1985-08-02 |
Family
ID=15557266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15320279A Expired JPS6033310B2 (en) | 1979-11-26 | 1979-11-26 | transistor mount |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6033310B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6583987B2 (en) * | 1999-02-26 | 2003-06-24 | Intel Corporation | Electromagnetic interference and heatsinking |
-
1979
- 1979-11-26 JP JP15320279A patent/JPS6033310B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6583987B2 (en) * | 1999-02-26 | 2003-06-24 | Intel Corporation | Electromagnetic interference and heatsinking |
Also Published As
Publication number | Publication date |
---|---|
JPS6033310B2 (en) | 1985-08-02 |
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