JPS567441A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS567441A
JPS567441A JP8135779A JP8135779A JPS567441A JP S567441 A JPS567441 A JP S567441A JP 8135779 A JP8135779 A JP 8135779A JP 8135779 A JP8135779 A JP 8135779A JP S567441 A JPS567441 A JP S567441A
Authority
JP
Japan
Prior art keywords
ring
bonding
arm
rollers
cam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8135779A
Other languages
Japanese (ja)
Inventor
Yuzo Taniguchi
Isamu Yamazaki
Michio Tanimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8135779A priority Critical patent/JPS567441A/en
Publication of JPS567441A publication Critical patent/JPS567441A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To conduct accurate bonding at high speed by a mechanism wherein cam followers are contacted on the inner and outer circumferential surfaces of a rotating ring, a clearance is formed at a fixed circumferential portion, and the vertical motion of a rear end of a bonding arm is controlled. CONSTITUTION:A ring 25 is formed on the circumference of a disc 24 of a cam 23. Rollers 20, 21 are mounted on the inner circumferential and outer circumferential surfaces 26, 27 of the ring, and a screw 28 fitted to supporting pieces 18, 19 is adjusted to closely contact the rollers and the ring surfaces at all times. A capillary 3 falls by means of the inner circumferential surface 26. A thin portion is formed at a fixed portion of the circumference of the ring, a clearance is made up, and bonding pressure is applied by means of a spring 29. Thus, when a bonding arm is vertically moved around a shaft 17 by means of the cam 23 and a wire is connected, the capillary 3 does not vibrate because a rear end of the arm 1 is held by means of the rollers, the arm 1 also does not vibrate because the supporting pieces 18, 19 are thick and short and deflection is not formed, and accurate positive wire bonding is enabled even when the wire is bonded at high speed.
JP8135779A 1979-06-29 1979-06-29 Wire bonding device Pending JPS567441A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8135779A JPS567441A (en) 1979-06-29 1979-06-29 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8135779A JPS567441A (en) 1979-06-29 1979-06-29 Wire bonding device

Publications (1)

Publication Number Publication Date
JPS567441A true JPS567441A (en) 1981-01-26

Family

ID=13744091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8135779A Pending JPS567441A (en) 1979-06-29 1979-06-29 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS567441A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5977503U (en) * 1982-11-13 1984-05-25 株式会社神戸製鋼所 spindle support device
US5011061A (en) * 1988-07-22 1991-04-30 Matsushita Electric Industrial Co., Ltd. Wire bonding device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5977503U (en) * 1982-11-13 1984-05-25 株式会社神戸製鋼所 spindle support device
JPH0114332Y2 (en) * 1982-11-13 1989-04-26
US5011061A (en) * 1988-07-22 1991-04-30 Matsushita Electric Industrial Co., Ltd. Wire bonding device

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