JPS5671947A - Foiling - Google Patents

Foiling

Info

Publication number
JPS5671947A
JPS5671947A JP14896779A JP14896779A JPS5671947A JP S5671947 A JPS5671947 A JP S5671947A JP 14896779 A JP14896779 A JP 14896779A JP 14896779 A JP14896779 A JP 14896779A JP S5671947 A JPS5671947 A JP S5671947A
Authority
JP
Japan
Prior art keywords
frames
pieces
stage
cut
foiling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14896779A
Other languages
Japanese (ja)
Other versions
JPS6315743B2 (en
Inventor
Fumio Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14896779A priority Critical patent/JPS5671947A/en
Publication of JPS5671947A publication Critical patent/JPS5671947A/en
Publication of JPS6315743B2 publication Critical patent/JPS6315743B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To improve foiling without lowering the temperature of lead frames on a stage by enabling a vacuum chuck foiling a given portion of the lead frames with cut metallic foil pieces held to rise in temperature like the frames. CONSTITUTION:A stage 13 holding intermittently-transferring lead frames 12 is made of a guide 23 and a cover 24 and an opening into which cut gold ribbon 4 foils pieces are inserted for the attachment thereof to the frames 12 is provided on the cover 24. A frame table 21 is placed on the side face of the stage 13, and a spool 5 round which gold ribbon 4 is wound, a vacuum chuck 9, a chuck holder 8, a transfer 10, a heating unit 11, a cam 22 and so forth are provided thereon. Thereby, the ribbon 4 is intermittently drawn out and cut to pieces using a cutter. The pieces are adsorbed by the chuck 9 heated to about 350 deg.C and pressed into the opening 25 and fastened to the frames 1.
JP14896779A 1979-11-19 1979-11-19 Foiling Granted JPS5671947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14896779A JPS5671947A (en) 1979-11-19 1979-11-19 Foiling

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14896779A JPS5671947A (en) 1979-11-19 1979-11-19 Foiling

Publications (2)

Publication Number Publication Date
JPS5671947A true JPS5671947A (en) 1981-06-15
JPS6315743B2 JPS6315743B2 (en) 1988-04-06

Family

ID=15464662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14896779A Granted JPS5671947A (en) 1979-11-19 1979-11-19 Foiling

Country Status (1)

Country Link
JP (1) JPS5671947A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5868943A (en) * 1981-10-20 1983-04-25 Mitsubishi Electric Corp Solder material supplier for die bonding
JPS5965532U (en) * 1982-10-23 1984-05-01 日本電気株式会社 Solder supply unit
JPS6052028A (en) * 1983-09-01 1985-03-23 Hitachi Chem Co Ltd Manufacture of semiconductor device
JP2011241685A (en) * 2010-05-14 2011-12-01 Honda Motor Co Ltd Flange fastening structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5868943A (en) * 1981-10-20 1983-04-25 Mitsubishi Electric Corp Solder material supplier for die bonding
JPS5965532U (en) * 1982-10-23 1984-05-01 日本電気株式会社 Solder supply unit
JPS6052028A (en) * 1983-09-01 1985-03-23 Hitachi Chem Co Ltd Manufacture of semiconductor device
JP2011241685A (en) * 2010-05-14 2011-12-01 Honda Motor Co Ltd Flange fastening structure

Also Published As

Publication number Publication date
JPS6315743B2 (en) 1988-04-06

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