JPS5669893A - Method of manufacturing circuit board - Google Patents
Method of manufacturing circuit boardInfo
- Publication number
- JPS5669893A JPS5669893A JP14507579A JP14507579A JPS5669893A JP S5669893 A JPS5669893 A JP S5669893A JP 14507579 A JP14507579 A JP 14507579A JP 14507579 A JP14507579 A JP 14507579A JP S5669893 A JPS5669893 A JP S5669893A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- manufacturing circuit
- manufacturing
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14507579A JPS5669893A (en) | 1979-11-09 | 1979-11-09 | Method of manufacturing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14507579A JPS5669893A (en) | 1979-11-09 | 1979-11-09 | Method of manufacturing circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5669893A true JPS5669893A (en) | 1981-06-11 |
| JPS5745079B2 JPS5745079B2 (ref) | 1982-09-25 |
Family
ID=15376795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14507579A Granted JPS5669893A (en) | 1979-11-09 | 1979-11-09 | Method of manufacturing circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5669893A (ref) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01199497A (ja) * | 1987-11-10 | 1989-08-10 | Ibiden Co Ltd | 電子部品塔載用基板 |
| JPH0274099A (ja) * | 1988-09-09 | 1990-03-14 | Murata Mfg Co Ltd | 電子部品内蔵多層樹脂基板 |
| WO2018079479A1 (ja) * | 2016-10-27 | 2018-05-03 | 株式会社村田製作所 | 多層基板およびその製造方法 |
-
1979
- 1979-11-09 JP JP14507579A patent/JPS5669893A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01199497A (ja) * | 1987-11-10 | 1989-08-10 | Ibiden Co Ltd | 電子部品塔載用基板 |
| JPH0274099A (ja) * | 1988-09-09 | 1990-03-14 | Murata Mfg Co Ltd | 電子部品内蔵多層樹脂基板 |
| WO2018079479A1 (ja) * | 2016-10-27 | 2018-05-03 | 株式会社村田製作所 | 多層基板およびその製造方法 |
| JPWO2018079479A1 (ja) * | 2016-10-27 | 2019-02-07 | 株式会社村田製作所 | 多層基板およびその製造方法 |
| US11075092B2 (en) | 2016-10-27 | 2021-07-27 | Murata Manufacturing Co., Ltd. | Multi-layer substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5745079B2 (ref) | 1982-09-25 |
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