JPS5661472A - Hot-melt type adhesive composition - Google Patents
Hot-melt type adhesive compositionInfo
- Publication number
- JPS5661472A JPS5661472A JP13837179A JP13837179A JPS5661472A JP S5661472 A JPS5661472 A JP S5661472A JP 13837179 A JP13837179 A JP 13837179A JP 13837179 A JP13837179 A JP 13837179A JP S5661472 A JPS5661472 A JP S5661472A
- Authority
- JP
- Japan
- Prior art keywords
- hot
- adhesive composition
- type adhesive
- melt type
- tackifier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: To obtain a hot-melt type adhesive composition having excellent adhesion and high reliability in a wide temperatuere range by mixing a dimer acid-based polyamide, an ionomer resin, an ethylenic copolymer, and a tackifier in specific proportions.
CONSTITUTION: A dimer acid-based polyamide (A) (e.g., versalon 1,300 made by Henckel Japan), an ionomer resin (B) (e.g., Hy-milan 1,652 made by Mitsui Polychemcial Co.), and an ethylenic copolymer (C) (e.g., perferably an ethylene- vinyl acetate copolymer) are mixed together in proportions of (A)/(B) of 8:2W4:6 and (B)+(C)/(A) of 7:3W3:7, and then 100pts.wt. mixture is mixed with 5W 20pts.wt. tackifier (D) (e.g., TAF 100 from Mitsui Sekiyukagaku Co.) to obtain a hot-melt type adhesive composition.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13837179A JPS5661472A (en) | 1979-10-25 | 1979-10-25 | Hot-melt type adhesive composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13837179A JPS5661472A (en) | 1979-10-25 | 1979-10-25 | Hot-melt type adhesive composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5661472A true JPS5661472A (en) | 1981-05-26 |
Family
ID=15220363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13837179A Pending JPS5661472A (en) | 1979-10-25 | 1979-10-25 | Hot-melt type adhesive composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5661472A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0795593A3 (en) * | 1996-03-15 | 1998-10-14 | H.B. FULLER LICENSING & FINANCING, INC. | Polyamide adhesives having improved bookbinding characteristics |
-
1979
- 1979-10-25 JP JP13837179A patent/JPS5661472A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0795593A3 (en) * | 1996-03-15 | 1998-10-14 | H.B. FULLER LICENSING & FINANCING, INC. | Polyamide adhesives having improved bookbinding characteristics |
AU720179B2 (en) * | 1996-03-15 | 2000-05-25 | H.B. Fuller Licensing And Financing Inc. | Polyamide adhesives having improved bookbinding characteristics |
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