JPS5661472A - Hot-melt type adhesive composition - Google Patents

Hot-melt type adhesive composition

Info

Publication number
JPS5661472A
JPS5661472A JP13837179A JP13837179A JPS5661472A JP S5661472 A JPS5661472 A JP S5661472A JP 13837179 A JP13837179 A JP 13837179A JP 13837179 A JP13837179 A JP 13837179A JP S5661472 A JPS5661472 A JP S5661472A
Authority
JP
Japan
Prior art keywords
hot
adhesive composition
type adhesive
melt type
tackifier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13837179A
Other languages
Japanese (ja)
Inventor
Tetsuharu Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP13837179A priority Critical patent/JPS5661472A/en
Publication of JPS5661472A publication Critical patent/JPS5661472A/en
Pending legal-status Critical Current

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  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To obtain a hot-melt type adhesive composition having excellent adhesion and high reliability in a wide temperatuere range by mixing a dimer acid-based polyamide, an ionomer resin, an ethylenic copolymer, and a tackifier in specific proportions.
CONSTITUTION: A dimer acid-based polyamide (A) (e.g., versalon 1,300 made by Henckel Japan), an ionomer resin (B) (e.g., Hy-milan 1,652 made by Mitsui Polychemcial Co.), and an ethylenic copolymer (C) (e.g., perferably an ethylene- vinyl acetate copolymer) are mixed together in proportions of (A)/(B) of 8:2W4:6 and (B)+(C)/(A) of 7:3W3:7, and then 100pts.wt. mixture is mixed with 5W 20pts.wt. tackifier (D) (e.g., TAF 100 from Mitsui Sekiyukagaku Co.) to obtain a hot-melt type adhesive composition.
COPYRIGHT: (C)1981,JPO&Japio
JP13837179A 1979-10-25 1979-10-25 Hot-melt type adhesive composition Pending JPS5661472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13837179A JPS5661472A (en) 1979-10-25 1979-10-25 Hot-melt type adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13837179A JPS5661472A (en) 1979-10-25 1979-10-25 Hot-melt type adhesive composition

Publications (1)

Publication Number Publication Date
JPS5661472A true JPS5661472A (en) 1981-05-26

Family

ID=15220363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13837179A Pending JPS5661472A (en) 1979-10-25 1979-10-25 Hot-melt type adhesive composition

Country Status (1)

Country Link
JP (1) JPS5661472A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0795593A3 (en) * 1996-03-15 1998-10-14 H.B. FULLER LICENSING & FINANCING, INC. Polyamide adhesives having improved bookbinding characteristics

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0795593A3 (en) * 1996-03-15 1998-10-14 H.B. FULLER LICENSING & FINANCING, INC. Polyamide adhesives having improved bookbinding characteristics
AU720179B2 (en) * 1996-03-15 2000-05-25 H.B. Fuller Licensing And Financing Inc. Polyamide adhesives having improved bookbinding characteristics

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