JPS5655572A - Oxidizing method for copper or copper alloy - Google Patents

Oxidizing method for copper or copper alloy

Info

Publication number
JPS5655572A
JPS5655572A JP12978279A JP12978279A JPS5655572A JP S5655572 A JPS5655572 A JP S5655572A JP 12978279 A JP12978279 A JP 12978279A JP 12978279 A JP12978279 A JP 12978279A JP S5655572 A JPS5655572 A JP S5655572A
Authority
JP
Japan
Prior art keywords
copper
hydrogen peroxide
nitric acid
copper nitrate
nitrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12978279A
Other languages
Japanese (ja)
Other versions
JPS5752426B2 (en
Inventor
Seiju Maejima
Kazuo Isawa
Kaoru Saito
Takao Suzuki
Katsumaro Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP12978279A priority Critical patent/JPS5655572A/en
Publication of JPS5655572A publication Critical patent/JPS5655572A/en
Publication of JPS5752426B2 publication Critical patent/JPS5752426B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Processes Specially Adapted For Manufacturing Cables (AREA)
  • Chemical Treatment Of Metals (AREA)

Abstract

PURPOSE: To form copper oxide film which is dense and excellent in sticking property in a short time, by treating copper or copper alloy in a mixed aqueous soln. of hydrogen peroxide with nitric acid and copper nitrate.
CONSTITUTION: Copper or copper alloy is previously degreased and descaled, then it is immersed in a mixed aqueous soln. of hydrogen peroxide with nitric acid, hydrogen peroxide with copper nitrate, or hydrogen peroxide with nitric acid and copper nitrate. The concns. of nitric acid, copper nitrate, and hydrogen peroxide are respectively 0.1W15vol%, 0.001W1wt%, and 5W50vol%. The treatment is performed at about ordinary temp. W60°C for 10secW15min. This method allows to accelerate the decomposition of hydrogen peroxide to form a large amount of activated oxygen, which exerts oxidizing action on the surface of the material to be treated thereby forming copper oxide film. The material treated by this method is used as electrical insulating material including wire rod or material of complicated shape.
COPYRIGHT: (C)1981,JPO&Japio
JP12978279A 1979-10-08 1979-10-08 Oxidizing method for copper or copper alloy Granted JPS5655572A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12978279A JPS5655572A (en) 1979-10-08 1979-10-08 Oxidizing method for copper or copper alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12978279A JPS5655572A (en) 1979-10-08 1979-10-08 Oxidizing method for copper or copper alloy

Publications (2)

Publication Number Publication Date
JPS5655572A true JPS5655572A (en) 1981-05-16
JPS5752426B2 JPS5752426B2 (en) 1982-11-08

Family

ID=15018082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12978279A Granted JPS5655572A (en) 1979-10-08 1979-10-08 Oxidizing method for copper or copper alloy

Country Status (1)

Country Link
JP (1) JPS5655572A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001064780A (en) * 1999-07-09 2001-03-13 Samsung Electro Mech Co Ltd Chemical film composition and formation of chemical film using the composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001064780A (en) * 1999-07-09 2001-03-13 Samsung Electro Mech Co Ltd Chemical film composition and formation of chemical film using the composition

Also Published As

Publication number Publication date
JPS5752426B2 (en) 1982-11-08

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