JPS5655572A - Oxidizing method for copper or copper alloy - Google Patents
Oxidizing method for copper or copper alloyInfo
- Publication number
- JPS5655572A JPS5655572A JP12978279A JP12978279A JPS5655572A JP S5655572 A JPS5655572 A JP S5655572A JP 12978279 A JP12978279 A JP 12978279A JP 12978279 A JP12978279 A JP 12978279A JP S5655572 A JPS5655572 A JP S5655572A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- hydrogen peroxide
- nitric acid
- copper nitrate
- nitrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
PURPOSE: To form copper oxide film which is dense and excellent in sticking property in a short time, by treating copper or copper alloy in a mixed aqueous soln. of hydrogen peroxide with nitric acid and copper nitrate.
CONSTITUTION: Copper or copper alloy is previously degreased and descaled, then it is immersed in a mixed aqueous soln. of hydrogen peroxide with nitric acid, hydrogen peroxide with copper nitrate, or hydrogen peroxide with nitric acid and copper nitrate. The concns. of nitric acid, copper nitrate, and hydrogen peroxide are respectively 0.1W15vol%, 0.001W1wt%, and 5W50vol%. The treatment is performed at about ordinary temp. W60°C for 10secW15min. This method allows to accelerate the decomposition of hydrogen peroxide to form a large amount of activated oxygen, which exerts oxidizing action on the surface of the material to be treated thereby forming copper oxide film. The material treated by this method is used as electrical insulating material including wire rod or material of complicated shape.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12978279A JPS5655572A (en) | 1979-10-08 | 1979-10-08 | Oxidizing method for copper or copper alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12978279A JPS5655572A (en) | 1979-10-08 | 1979-10-08 | Oxidizing method for copper or copper alloy |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5655572A true JPS5655572A (en) | 1981-05-16 |
JPS5752426B2 JPS5752426B2 (en) | 1982-11-08 |
Family
ID=15018082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12978279A Granted JPS5655572A (en) | 1979-10-08 | 1979-10-08 | Oxidizing method for copper or copper alloy |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5655572A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001064780A (en) * | 1999-07-09 | 2001-03-13 | Samsung Electro Mech Co Ltd | Chemical film composition and formation of chemical film using the composition |
-
1979
- 1979-10-08 JP JP12978279A patent/JPS5655572A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001064780A (en) * | 1999-07-09 | 2001-03-13 | Samsung Electro Mech Co Ltd | Chemical film composition and formation of chemical film using the composition |
Also Published As
Publication number | Publication date |
---|---|
JPS5752426B2 (en) | 1982-11-08 |
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