JPS5653552Y2 - - Google Patents

Info

Publication number
JPS5653552Y2
JPS5653552Y2 JP1976074492U JP7449276U JPS5653552Y2 JP S5653552 Y2 JPS5653552 Y2 JP S5653552Y2 JP 1976074492 U JP1976074492 U JP 1976074492U JP 7449276 U JP7449276 U JP 7449276U JP S5653552 Y2 JPS5653552 Y2 JP S5653552Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1976074492U
Other languages
Japanese (ja)
Other versions
JPS52164452U (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976074492U priority Critical patent/JPS5653552Y2/ja
Publication of JPS52164452U publication Critical patent/JPS52164452U/ja
Application granted granted Critical
Publication of JPS5653552Y2 publication Critical patent/JPS5653552Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1976074492U 1976-06-08 1976-06-08 Expired JPS5653552Y2 (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976074492U JPS5653552Y2 (cg-RX-API-DMAC10.html) 1976-06-08 1976-06-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976074492U JPS5653552Y2 (cg-RX-API-DMAC10.html) 1976-06-08 1976-06-08

Publications (2)

Publication Number Publication Date
JPS52164452U JPS52164452U (cg-RX-API-DMAC10.html) 1977-12-13
JPS5653552Y2 true JPS5653552Y2 (cg-RX-API-DMAC10.html) 1981-12-14

Family

ID=28547720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976074492U Expired JPS5653552Y2 (cg-RX-API-DMAC10.html) 1976-06-08 1976-06-08

Country Status (1)

Country Link
JP (1) JPS5653552Y2 (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6591234B2 (ja) * 2015-08-21 2019-10-16 ルネサスエレクトロニクス株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037366A (cg-RX-API-DMAC10.html) * 1973-08-06 1975-04-08

Also Published As

Publication number Publication date
JPS52164452U (cg-RX-API-DMAC10.html) 1977-12-13

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