JPS52164452U - - Google Patents
Info
- Publication number
- JPS52164452U JPS52164452U JP1976074492U JP7449276U JPS52164452U JP S52164452 U JPS52164452 U JP S52164452U JP 1976074492 U JP1976074492 U JP 1976074492U JP 7449276 U JP7449276 U JP 7449276U JP S52164452 U JPS52164452 U JP S52164452U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976074492U JPS5653552Y2 (cg-RX-API-DMAC10.html) | 1976-06-08 | 1976-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976074492U JPS5653552Y2 (cg-RX-API-DMAC10.html) | 1976-06-08 | 1976-06-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52164452U true JPS52164452U (cg-RX-API-DMAC10.html) | 1977-12-13 |
| JPS5653552Y2 JPS5653552Y2 (cg-RX-API-DMAC10.html) | 1981-12-14 |
Family
ID=28547720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976074492U Expired JPS5653552Y2 (cg-RX-API-DMAC10.html) | 1976-06-08 | 1976-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5653552Y2 (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017041603A (ja) * | 2015-08-21 | 2017-02-23 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5037366A (cg-RX-API-DMAC10.html) * | 1973-08-06 | 1975-04-08 |
-
1976
- 1976-06-08 JP JP1976074492U patent/JPS5653552Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5037366A (cg-RX-API-DMAC10.html) * | 1973-08-06 | 1975-04-08 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017041603A (ja) * | 2015-08-21 | 2017-02-23 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US10553558B2 (en) | 2015-08-21 | 2020-02-04 | Renesas Electronics Corporation | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5653552Y2 (cg-RX-API-DMAC10.html) | 1981-12-14 |