JPS56500988A - - Google Patents
Info
- Publication number
- JPS56500988A JPS56500988A JP50137780A JP50137780A JPS56500988A JP S56500988 A JPS56500988 A JP S56500988A JP 50137780 A JP50137780 A JP 50137780A JP 50137780 A JP50137780 A JP 50137780A JP S56500988 A JPS56500988 A JP S56500988A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W46/00—Marks applied to devices, e.g. for alignment or identification
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
Landscapes
- Thyristors (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB7923223 | 1979-07-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56500988A true JPS56500988A (https=) | 1981-07-16 |
| JPH0214777B2 JPH0214777B2 (https=) | 1990-04-10 |
Family
ID=10506280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50137780A Expired - Lifetime JPH0214777B2 (https=) | 1979-07-04 | 1980-07-03 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4477826A (https=) |
| EP (1) | EP0022359B1 (https=) |
| JP (1) | JPH0214777B2 (https=) |
| DE (1) | DE3064121D1 (https=) |
| WO (1) | WO1981000172A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6038868B2 (ja) * | 1981-11-06 | 1985-09-03 | 富士通株式会社 | 半導体パツケ−ジ |
| US4567505A (en) * | 1983-10-27 | 1986-01-28 | The Board Of Trustees Of The Leland Stanford Junior University | Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like |
| JPS60177674A (ja) * | 1984-02-23 | 1985-09-11 | Mitsubishi Electric Corp | 圧接形半導体装置の插入電極板の固定方法 |
| ATE54635T1 (de) * | 1984-11-30 | 1990-08-15 | Stephen Janson | Vorrichtung zur oeffnung der fussriemen eines windbrettes. |
| US5053358A (en) * | 1988-08-01 | 1991-10-01 | Sundstrand Corporation | Method of manufacturing hermetically sealed compression bonded circuit assemblies |
| US5034803A (en) * | 1988-08-01 | 1991-07-23 | Sundstrand Corporation | Compression bonded semiconductor device having a plurality of stacked hermetically sealed circuit assemblies |
| FR2665817B1 (fr) * | 1990-08-07 | 1996-08-02 | Auxilec | Diode a electrode et a boitier assembles sans soudure ni sertissage, et pont redresseur realise avec de telles diodes. |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL270438A (https=) * | 1960-11-02 | 1900-01-01 | ||
| FR1317754A (https=) * | 1961-03-17 | 1963-05-08 | ||
| US3418543A (en) * | 1965-03-01 | 1968-12-24 | Westinghouse Electric Corp | Semiconductor device contact structure |
| US3473303A (en) * | 1967-02-23 | 1969-10-21 | Howard Dale Ellis | Ear stripping mechanism for harvester for sweet corn |
| US3783044A (en) * | 1971-04-09 | 1974-01-01 | Motorola Inc | Photoresist keys and depth indicator |
| SE373689B (sv) * | 1973-06-12 | 1975-02-10 | Asea Ab | Halvledaranordning bestaende av en tyristor med styrelektrod, vars halvledarskiva er innesluten i en dosa |
| GB1465328A (en) * | 1973-06-19 | 1977-02-23 | Westinghouse Electric Corp | Compression bond assembly for a planar semiconductor device |
| JPS5138969A (https=) * | 1974-09-30 | 1976-03-31 | Hitachi Ltd | |
| US4289834A (en) * | 1977-10-20 | 1981-09-15 | Ibm Corporation | Dense dry etched multi-level metallurgy with non-overlapped vias |
-
1980
- 1980-07-03 JP JP50137780A patent/JPH0214777B2/ja not_active Expired - Lifetime
- 1980-07-03 WO PCT/GB1980/000113 patent/WO1981000172A1/en not_active Ceased
- 1980-07-03 EP EP19800302266 patent/EP0022359B1/en not_active Expired
- 1980-07-03 DE DE8080302266T patent/DE3064121D1/de not_active Expired
- 1980-07-03 US US06/243,904 patent/US4477826A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| WO1981000172A1 (en) | 1981-01-22 |
| JPH0214777B2 (https=) | 1990-04-10 |
| EP0022359A1 (en) | 1981-01-14 |
| US4477826A (en) | 1984-10-16 |
| DE3064121D1 (en) | 1983-08-18 |
| EP0022359B1 (en) | 1983-07-13 |