JPS56500988A - - Google Patents

Info

Publication number
JPS56500988A
JPS56500988A JP50137780A JP50137780A JPS56500988A JP S56500988 A JPS56500988 A JP S56500988A JP 50137780 A JP50137780 A JP 50137780A JP 50137780 A JP50137780 A JP 50137780A JP S56500988 A JPS56500988 A JP S56500988A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50137780A
Other versions
JPH0214777B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS56500988A publication Critical patent/JPS56500988A/ja
Publication of JPH0214777B2 publication Critical patent/JPH0214777B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thyristors (AREA)
JP50137780A 1979-07-04 1980-07-03 Expired - Lifetime JPH0214777B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7923223 1979-07-04

Publications (2)

Publication Number Publication Date
JPS56500988A true JPS56500988A (ja) 1981-07-16
JPH0214777B2 JPH0214777B2 (ja) 1990-04-10

Family

ID=10506280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50137780A Expired - Lifetime JPH0214777B2 (ja) 1979-07-04 1980-07-03

Country Status (5)

Country Link
US (1) US4477826A (ja)
EP (1) EP0022359B1 (ja)
JP (1) JPH0214777B2 (ja)
DE (1) DE3064121D1 (ja)
WO (1) WO1981000172A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6038868B2 (ja) * 1981-11-06 1985-09-03 富士通株式会社 半導体パツケ−ジ
US4567505A (en) * 1983-10-27 1986-01-28 The Board Of Trustees Of The Leland Stanford Junior University Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
JPS60177674A (ja) * 1984-02-23 1985-09-11 Mitsubishi Electric Corp 圧接形半導体装置の插入電極板の固定方法
DE3578756D1 (de) * 1984-11-30 1990-08-23 Stephen Janson Vorrichtung zur oeffnung der fussriemen eines windbrettes.
US5053358A (en) * 1988-08-01 1991-10-01 Sundstrand Corporation Method of manufacturing hermetically sealed compression bonded circuit assemblies
US5034803A (en) * 1988-08-01 1991-07-23 Sundstrand Corporation Compression bonded semiconductor device having a plurality of stacked hermetically sealed circuit assemblies
FR2665817B1 (fr) * 1990-08-07 1996-08-02 Auxilec Diode a electrode et a boitier assembles sans soudure ni sertissage, et pont redresseur realise avec de telles diodes.

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL270438A (ja) * 1960-11-02 1900-01-01
FR1317754A (ja) * 1961-03-17 1963-05-08
US3418543A (en) * 1965-03-01 1968-12-24 Westinghouse Electric Corp Semiconductor device contact structure
US3473303A (en) * 1967-02-23 1969-10-21 Howard Dale Ellis Ear stripping mechanism for harvester for sweet corn
US3783044A (en) * 1971-04-09 1974-01-01 Motorola Inc Photoresist keys and depth indicator
SE373689B (sv) * 1973-06-12 1975-02-10 Asea Ab Halvledaranordning bestaende av en tyristor med styrelektrod, vars halvledarskiva er innesluten i en dosa
GB1465328A (en) * 1973-06-19 1977-02-23 Westinghouse Electric Corp Compression bond assembly for a planar semiconductor device
JPS5138969A (ja) * 1974-09-30 1976-03-31 Hitachi Ltd
US4289834A (en) * 1977-10-20 1981-09-15 Ibm Corporation Dense dry etched multi-level metallurgy with non-overlapped vias

Also Published As

Publication number Publication date
JPH0214777B2 (ja) 1990-04-10
EP0022359B1 (en) 1983-07-13
WO1981000172A1 (en) 1981-01-22
DE3064121D1 (en) 1983-08-18
EP0022359A1 (en) 1981-01-14
US4477826A (en) 1984-10-16

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