JPS5647967Y2 - - Google Patents

Info

Publication number
JPS5647967Y2
JPS5647967Y2 JP6000176U JP6000176U JPS5647967Y2 JP S5647967 Y2 JPS5647967 Y2 JP S5647967Y2 JP 6000176 U JP6000176 U JP 6000176U JP 6000176 U JP6000176 U JP 6000176U JP S5647967 Y2 JPS5647967 Y2 JP S5647967Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6000176U
Other versions
JPS52150961U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6000176U priority Critical patent/JPS5647967Y2/ja
Publication of JPS52150961U publication Critical patent/JPS52150961U/ja
Application granted granted Critical
Publication of JPS5647967Y2 publication Critical patent/JPS5647967Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP6000176U 1976-05-11 1976-05-11 Expired JPS5647967Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6000176U JPS5647967Y2 (ja) 1976-05-11 1976-05-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6000176U JPS5647967Y2 (ja) 1976-05-11 1976-05-11

Publications (2)

Publication Number Publication Date
JPS52150961U JPS52150961U (ja) 1977-11-16
JPS5647967Y2 true JPS5647967Y2 (ja) 1981-11-10

Family

ID=28520056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6000176U Expired JPS5647967Y2 (ja) 1976-05-11 1976-05-11

Country Status (1)

Country Link
JP (1) JPS5647967Y2 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831555B2 (ja) * 1987-02-16 1996-03-27 日本電装株式会社 Ｓｉｐの製造方法
DE10247075A1 (de) * 2002-10-09 2004-04-22 Micronas Gmbh Trägereinrichtung für monolithisch integrierte Schaltungen

Also Published As

Publication number Publication date
JPS52150961U (ja) 1977-11-16

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