JPS5645933A - Electrically conductive resin composition - Google Patents

Electrically conductive resin composition

Info

Publication number
JPS5645933A
JPS5645933A JP12297079A JP12297079A JPS5645933A JP S5645933 A JPS5645933 A JP S5645933A JP 12297079 A JP12297079 A JP 12297079A JP 12297079 A JP12297079 A JP 12297079A JP S5645933 A JPS5645933 A JP S5645933A
Authority
JP
Japan
Prior art keywords
density
component
ethylene polymer
compsn
electrically conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12297079A
Other languages
Japanese (ja)
Other versions
JPS6324018B2 (en
Inventor
Hiroshi Yui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Petrochemical Co Ltd
Original Assignee
Mitsubishi Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Petrochemical Co Ltd filed Critical Mitsubishi Petrochemical Co Ltd
Priority to JP12297079A priority Critical patent/JPS5645933A/en
Publication of JPS5645933A publication Critical patent/JPS5645933A/en
Publication of JPS6324018B2 publication Critical patent/JPS6324018B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE: To provide a resin compsn. which excels in fabrication properties, the appearance of molded articles and electrical conductivity, by a method wherein carbon black is blended with a compsn. consisting of a low-density PE and a high-density PE in a specified proportion.
CONSTITUTION: In a resin compsn. comprising (A) an ethylene polymer having a density of 0.915W0.944g/cm3, (B) an ethylene polymer having a density of at least 0.945g/cm3 and (c) carbon black, the (A) component is used in an amount of 95W35wt% based on the combined weight of (A) and (B), the (B) component is used in an amount of 5W65wt% based on the combined weight of (A) and (B), and 3W100pts.wt. of the (C) component is blended with 100pts.wt. of (A) and (B) to obtain the desired electrically conductive resin compsn. By blending the high- density ethylene polymer of the (B) component with the low-density ethylene polymer of the (A) component in the specified amount, there is obtd. a carbon black- blended ethylene polymer compsn. which excels in fabrication properties and the appearance of molded articles and has increased electrical conductivity.
COPYRIGHT: (C)1981,JPO&Japio
JP12297079A 1979-09-25 1979-09-25 Electrically conductive resin composition Granted JPS5645933A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12297079A JPS5645933A (en) 1979-09-25 1979-09-25 Electrically conductive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12297079A JPS5645933A (en) 1979-09-25 1979-09-25 Electrically conductive resin composition

Publications (2)

Publication Number Publication Date
JPS5645933A true JPS5645933A (en) 1981-04-25
JPS6324018B2 JPS6324018B2 (en) 1988-05-19

Family

ID=14849096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12297079A Granted JPS5645933A (en) 1979-09-25 1979-09-25 Electrically conductive resin composition

Country Status (1)

Country Link
JP (1) JPS5645933A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853932A (en) * 1981-09-28 1983-03-30 Tokyo Ink Kk Electrically conductive and heat-weldable resin composition for plastic and metal
JPS58118839A (en) * 1982-01-08 1983-07-15 Hitachi Cable Ltd Semiconductive composition
JPS5966436A (en) * 1982-10-08 1984-04-14 Furukawa Electric Co Ltd:The Semiconductive resin composition
JPS6031548A (en) * 1983-07-29 1985-02-18 Toshiba Corp Electrically conductive organic composition having ptc characteristics
JPS60199041A (en) * 1984-03-22 1985-10-08 Fujikura Ltd Semiconductive composition
JPS6112737A (en) * 1984-06-27 1986-01-21 Fujikura Ltd Mixture for semiconductive layer
JPS6112738A (en) * 1984-06-27 1986-01-21 Fujikura Ltd Mixture for semiconductive layer
JP2014193976A (en) * 2013-03-29 2014-10-09 Japan Polyethylene Corp Electric conductive polyethylene composition for injection molding and molded body and fuel system component using the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5214647A (en) * 1975-07-25 1977-02-03 Mitsubishi Petrochem Co Ltd Wire coating composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5214647A (en) * 1975-07-25 1977-02-03 Mitsubishi Petrochem Co Ltd Wire coating composition

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853932A (en) * 1981-09-28 1983-03-30 Tokyo Ink Kk Electrically conductive and heat-weldable resin composition for plastic and metal
JPS6223979B2 (en) * 1981-09-28 1987-05-26 Tokyo Inki Kk
JPS58118839A (en) * 1982-01-08 1983-07-15 Hitachi Cable Ltd Semiconductive composition
JPS5966436A (en) * 1982-10-08 1984-04-14 Furukawa Electric Co Ltd:The Semiconductive resin composition
JPH04106B2 (en) * 1982-10-08 1992-01-06 Furukawa Electric Co Ltd
JPS6031548A (en) * 1983-07-29 1985-02-18 Toshiba Corp Electrically conductive organic composition having ptc characteristics
JPH0367322B2 (en) * 1983-07-29 1991-10-22 Toshiba Kk
JPS60199041A (en) * 1984-03-22 1985-10-08 Fujikura Ltd Semiconductive composition
JPS6112737A (en) * 1984-06-27 1986-01-21 Fujikura Ltd Mixture for semiconductive layer
JPS6112738A (en) * 1984-06-27 1986-01-21 Fujikura Ltd Mixture for semiconductive layer
JP2014193976A (en) * 2013-03-29 2014-10-09 Japan Polyethylene Corp Electric conductive polyethylene composition for injection molding and molded body and fuel system component using the same

Also Published As

Publication number Publication date
JPS6324018B2 (en) 1988-05-19

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