JPS5645037A - Chip-type element mounter - Google Patents

Chip-type element mounter

Info

Publication number
JPS5645037A
JPS5645037A JP12065879A JP12065879A JPS5645037A JP S5645037 A JPS5645037 A JP S5645037A JP 12065879 A JP12065879 A JP 12065879A JP 12065879 A JP12065879 A JP 12065879A JP S5645037 A JPS5645037 A JP S5645037A
Authority
JP
Japan
Prior art keywords
chip
opening
plate
elements
scraping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12065879A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6311774B2 (enrdf_load_stackoverflow
Inventor
Masaaki Goto
Hitoshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12065879A priority Critical patent/JPS5645037A/ja
Publication of JPS5645037A publication Critical patent/JPS5645037A/ja
Publication of JPS6311774B2 publication Critical patent/JPS6311774B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
JP12065879A 1979-09-21 1979-09-21 Chip-type element mounter Granted JPS5645037A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12065879A JPS5645037A (en) 1979-09-21 1979-09-21 Chip-type element mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12065879A JPS5645037A (en) 1979-09-21 1979-09-21 Chip-type element mounter

Publications (2)

Publication Number Publication Date
JPS5645037A true JPS5645037A (en) 1981-04-24
JPS6311774B2 JPS6311774B2 (enrdf_load_stackoverflow) 1988-03-16

Family

ID=14791679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12065879A Granted JPS5645037A (en) 1979-09-21 1979-09-21 Chip-type element mounter

Country Status (1)

Country Link
JP (1) JPS5645037A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6311774B2 (enrdf_load_stackoverflow) 1988-03-16

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