JPS5644761A - Electroless plating method - Google Patents

Electroless plating method

Info

Publication number
JPS5644761A
JPS5644761A JP12042179A JP12042179A JPS5644761A JP S5644761 A JPS5644761 A JP S5644761A JP 12042179 A JP12042179 A JP 12042179A JP 12042179 A JP12042179 A JP 12042179A JP S5644761 A JPS5644761 A JP S5644761A
Authority
JP
Japan
Prior art keywords
filter
plating
plating soln
filtration
clogging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12042179A
Other languages
Japanese (ja)
Inventor
Koji Kamiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP12042179A priority Critical patent/JPS5644761A/en
Publication of JPS5644761A publication Critical patent/JPS5644761A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/168—Control of temperature, e.g. temperature of bath, substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE:To prevent the clogging of a filter so as to improve the operation efficiency of electroless plating process, by controlling the temp. of plating soln. at the filtering stage. CONSTITUTION:In circulation and filtration of electroless plating soln., the filter is clogged because of the progression of the electroeess plating reaction on the filter. Hence passage of the plating soln., having been cooled before filtration, through the filter allows to prevent the clogging due to the deposition of metal on the filter. For example, in the circulation and filtration of electroless copper plating soln., the bath is cooled by 15 deg.C from 70 deg.C to 55 deg.C. Hereby, use of the plating soln. for a week or more causes no clogging compared with about two days of conventional methods.
JP12042179A 1979-09-18 1979-09-18 Electroless plating method Pending JPS5644761A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12042179A JPS5644761A (en) 1979-09-18 1979-09-18 Electroless plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12042179A JPS5644761A (en) 1979-09-18 1979-09-18 Electroless plating method

Publications (1)

Publication Number Publication Date
JPS5644761A true JPS5644761A (en) 1981-04-24

Family

ID=14785799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12042179A Pending JPS5644761A (en) 1979-09-18 1979-09-18 Electroless plating method

Country Status (1)

Country Link
JP (1) JPS5644761A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61235567A (en) * 1985-04-10 1986-10-20 Chuo Seisakusho:Kk Method and apparatus for filtering plating liquid
JP5813649B2 (en) * 2010-10-14 2015-11-17 東京エレクトロン株式会社 Liquid processing apparatus and liquid processing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61235567A (en) * 1985-04-10 1986-10-20 Chuo Seisakusho:Kk Method and apparatus for filtering plating liquid
JPH0475315B2 (en) * 1985-04-10 1992-11-30
JP5813649B2 (en) * 2010-10-14 2015-11-17 東京エレクトロン株式会社 Liquid processing apparatus and liquid processing method

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