JPS564244A - Continuous vacuum treatment device for wafer - Google Patents
Continuous vacuum treatment device for waferInfo
- Publication number
- JPS564244A JPS564244A JP7920079A JP7920079A JPS564244A JP S564244 A JPS564244 A JP S564244A JP 7920079 A JP7920079 A JP 7920079A JP 7920079 A JP7920079 A JP 7920079A JP S564244 A JPS564244 A JP S564244A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- rest
- chamber
- treatment
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Vacuum Packaging (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7920079A JPS564244A (en) | 1979-06-25 | 1979-06-25 | Continuous vacuum treatment device for wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7920079A JPS564244A (en) | 1979-06-25 | 1979-06-25 | Continuous vacuum treatment device for wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS564244A true JPS564244A (en) | 1981-01-17 |
JPS6339102B2 JPS6339102B2 (ja) | 1988-08-03 |
Family
ID=13683312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7920079A Granted JPS564244A (en) | 1979-06-25 | 1979-06-25 | Continuous vacuum treatment device for wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS564244A (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57134946A (en) * | 1981-02-16 | 1982-08-20 | Toshiba Corp | Carrying device for semiconductor substrate |
JPS58118124A (ja) * | 1982-01-06 | 1983-07-14 | Hitachi Ltd | ウエ−ハロ−デイング法 |
JPS58155764U (ja) * | 1982-04-14 | 1983-10-18 | 鈴木 了 | バツテリ−液の自動補充装置 |
JPS59116372A (ja) * | 1982-12-23 | 1984-07-05 | Hitachi Ltd | 連続真空処理装置 |
US4483651A (en) * | 1980-08-14 | 1984-11-20 | Tokyo Ohka Kogyo Kabushiki Kaisha | Automatic apparatus for continuous treatment of leaf materials with gas plasma |
JPS6267832A (ja) * | 1985-09-20 | 1987-03-27 | Hitachi Ltd | 基板搬送方法 |
US4724874A (en) * | 1986-05-01 | 1988-02-16 | Asyst Technologies | Sealable transportable container having a particle filtering system |
US5037262A (en) * | 1988-07-15 | 1991-08-06 | Balzers Aktiengesellschaft | Holding device for a disk and application therefor |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04163302A (ja) * | 1990-10-18 | 1992-06-08 | Wacoal Corp | 人体にフィットする下着 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5023769A (ja) * | 1973-06-12 | 1975-03-14 | ||
JPS5039070A (ja) * | 1973-06-29 | 1975-04-10 |
-
1979
- 1979-06-25 JP JP7920079A patent/JPS564244A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5023769A (ja) * | 1973-06-12 | 1975-03-14 | ||
JPS5039070A (ja) * | 1973-06-29 | 1975-04-10 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4483651A (en) * | 1980-08-14 | 1984-11-20 | Tokyo Ohka Kogyo Kabushiki Kaisha | Automatic apparatus for continuous treatment of leaf materials with gas plasma |
JPS57134946A (en) * | 1981-02-16 | 1982-08-20 | Toshiba Corp | Carrying device for semiconductor substrate |
JPS58118124A (ja) * | 1982-01-06 | 1983-07-14 | Hitachi Ltd | ウエ−ハロ−デイング法 |
JPS58155764U (ja) * | 1982-04-14 | 1983-10-18 | 鈴木 了 | バツテリ−液の自動補充装置 |
JPS59116372A (ja) * | 1982-12-23 | 1984-07-05 | Hitachi Ltd | 連続真空処理装置 |
JPH0377274B2 (ja) * | 1982-12-23 | 1991-12-10 | Hitachi Ltd | |
JPS6267832A (ja) * | 1985-09-20 | 1987-03-27 | Hitachi Ltd | 基板搬送方法 |
US4724874A (en) * | 1986-05-01 | 1988-02-16 | Asyst Technologies | Sealable transportable container having a particle filtering system |
US5037262A (en) * | 1988-07-15 | 1991-08-06 | Balzers Aktiengesellschaft | Holding device for a disk and application therefor |
Also Published As
Publication number | Publication date |
---|---|
JPS6339102B2 (ja) | 1988-08-03 |
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