JPS5641092A - Laser processing device - Google Patents

Laser processing device

Info

Publication number
JPS5641092A
JPS5641092A JP11568479A JP11568479A JPS5641092A JP S5641092 A JPS5641092 A JP S5641092A JP 11568479 A JP11568479 A JP 11568479A JP 11568479 A JP11568479 A JP 11568479A JP S5641092 A JPS5641092 A JP S5641092A
Authority
JP
Japan
Prior art keywords
nozzle
laser beam
cutoff
temperature
fitted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11568479A
Other languages
Japanese (ja)
Inventor
Kazuo Nakayama
Sadao Sugiyama
Hidekazu Aoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11568479A priority Critical patent/JPS5641092A/en
Publication of JPS5641092A publication Critical patent/JPS5641092A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To enable to obtain the processed material of excellent quality continuously, by loading a plurality of temperature sensors at the top of the nozzle fitted to the end of frame internally providing the condenser lens and through the automatic adjustment of the nozzle position with the sensor signal. CONSTITUTION:The laser beam 1 is condensed with the condenser lens 3 and the focus is formed around the surface of the processed object 8, and simultaneously the cutoff auxiliary gas such as oxygen is introduced from the gas inlet pipe 5 and it is jetted to the processed object 8 from the nozzle 4 tip, allowing the cutoff processing. In this case, the laser beam 1 is irradiated to the inner circumference of the nozzle 4 and the inner temperature of the nozzle 4 locally rises, then the temperature difference is caused to the temperature sensors 6a, 6b, 6c fitted with equal arrangement on the nozzle 4. Further, the nozzle 4 is moved so that the temperature difference can be minimized with the driving unit 7 and so that the laser beam can pass through the center of the nozzle 4. This can be applied to the welding and heat treatment nozzles as well as cutoff.
JP11568479A 1979-09-11 1979-09-11 Laser processing device Pending JPS5641092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11568479A JPS5641092A (en) 1979-09-11 1979-09-11 Laser processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11568479A JPS5641092A (en) 1979-09-11 1979-09-11 Laser processing device

Publications (1)

Publication Number Publication Date
JPS5641092A true JPS5641092A (en) 1981-04-17

Family

ID=14668699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11568479A Pending JPS5641092A (en) 1979-09-11 1979-09-11 Laser processing device

Country Status (1)

Country Link
JP (1) JPS5641092A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0327889A (en) * 1989-06-27 1991-02-06 Amada Co Ltd Working head of laser beam machine
WO2012101533A1 (en) 2011-01-27 2012-08-02 Bystronic Laser Ag Laser processing machine, in particular laser cutting machine, and method for centering a laser beam, in particular a focused laser beam
JP2015033705A (en) * 2013-08-08 2015-02-19 株式会社アマダ Laser nozzle and laser processing head
US9289852B2 (en) 2011-01-27 2016-03-22 Bystronic Laser Ag Laser processing machine, laser cutting machine, and method for adjusting a focused laser beam
JP2016524061A (en) * 2013-06-10 2016-08-12 サウジ アラビアン オイル カンパニー Downhole deep tunnel excavation tool and method using high power laser beam
CN106216847A (en) * 2016-07-29 2016-12-14 广州创乐激光设备有限公司 A kind of Z axis dynamic compensation marking device and method
US9839975B2 (en) 2013-12-12 2017-12-12 Bystronic Laser Ag Method for configuring a laser machining machine
US9937590B2 (en) 2010-07-22 2018-04-10 Bystronic Laser Ag Laser processing machine

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0327889A (en) * 1989-06-27 1991-02-06 Amada Co Ltd Working head of laser beam machine
US9937590B2 (en) 2010-07-22 2018-04-10 Bystronic Laser Ag Laser processing machine
WO2012101533A1 (en) 2011-01-27 2012-08-02 Bystronic Laser Ag Laser processing machine, in particular laser cutting machine, and method for centering a laser beam, in particular a focused laser beam
US9289852B2 (en) 2011-01-27 2016-03-22 Bystronic Laser Ag Laser processing machine, laser cutting machine, and method for adjusting a focused laser beam
US9296067B2 (en) 2011-01-27 2016-03-29 Bystronic Laser Ag Laser processing machine, in particular laser cutting machine, and method for centering a laser beam, in particular a focused laser beam
JP2016524061A (en) * 2013-06-10 2016-08-12 サウジ アラビアン オイル カンパニー Downhole deep tunnel excavation tool and method using high power laser beam
JP2015033705A (en) * 2013-08-08 2015-02-19 株式会社アマダ Laser nozzle and laser processing head
US9839975B2 (en) 2013-12-12 2017-12-12 Bystronic Laser Ag Method for configuring a laser machining machine
CN106216847A (en) * 2016-07-29 2016-12-14 广州创乐激光设备有限公司 A kind of Z axis dynamic compensation marking device and method

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