JPS5640994B2 - - Google Patents

Info

Publication number
JPS5640994B2
JPS5640994B2 JP3321373A JP3321373A JPS5640994B2 JP S5640994 B2 JPS5640994 B2 JP S5640994B2 JP 3321373 A JP3321373 A JP 3321373A JP 3321373 A JP3321373 A JP 3321373A JP S5640994 B2 JPS5640994 B2 JP S5640994B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3321373A
Other languages
Japanese (ja)
Other versions
JPS49122292A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3321373A priority Critical patent/JPS5640994B2/ja
Publication of JPS49122292A publication Critical patent/JPS49122292A/ja
Publication of JPS5640994B2 publication Critical patent/JPS5640994B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP3321373A 1973-03-22 1973-03-22 Expired JPS5640994B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3321373A JPS5640994B2 (enrdf_load_stackoverflow) 1973-03-22 1973-03-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3321373A JPS5640994B2 (enrdf_load_stackoverflow) 1973-03-22 1973-03-22

Publications (2)

Publication Number Publication Date
JPS49122292A JPS49122292A (enrdf_load_stackoverflow) 1974-11-22
JPS5640994B2 true JPS5640994B2 (enrdf_load_stackoverflow) 1981-09-25

Family

ID=12380155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3321373A Expired JPS5640994B2 (enrdf_load_stackoverflow) 1973-03-22 1973-03-22

Country Status (1)

Country Link
JP (1) JPS5640994B2 (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19638667C2 (de) 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
EP2282354B1 (de) 1996-06-26 2013-09-11 OSRAM Opto Semiconductors GmbH Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
TW383508B (en) 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
US5959316A (en) * 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
JP3775268B2 (ja) * 2001-09-03 2006-05-17 日亜化学工業株式会社 発光装置の形成方法
JP2005244259A (ja) * 2005-05-23 2005-09-08 Nichia Chem Ind Ltd 発光ダイオード
WO2007018039A1 (ja) 2005-08-05 2007-02-15 Matsushita Electric Industrial Co., Ltd. 半導体発光装置
JP5182399B2 (ja) * 2011-07-20 2013-04-17 三菱化学株式会社 白色発光素子
JP6326830B2 (ja) * 2013-02-28 2018-05-23 日亜化学工業株式会社 発光装置及びそれを備える照明装置

Also Published As

Publication number Publication date
JPS49122292A (enrdf_load_stackoverflow) 1974-11-22

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