JPS5640663U - - Google Patents
Info
- Publication number
- JPS5640663U JPS5640663U JP1979122875U JP12287579U JPS5640663U JP S5640663 U JPS5640663 U JP S5640663U JP 1979122875 U JP1979122875 U JP 1979122875U JP 12287579 U JP12287579 U JP 12287579U JP S5640663 U JPS5640663 U JP S5640663U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979122875U JPS5734766Y2 (cg-RX-API-DMAC7.html) | 1979-09-05 | 1979-09-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979122875U JPS5734766Y2 (cg-RX-API-DMAC7.html) | 1979-09-05 | 1979-09-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5640663U true JPS5640663U (cg-RX-API-DMAC7.html) | 1981-04-15 |
| JPS5734766Y2 JPS5734766Y2 (cg-RX-API-DMAC7.html) | 1982-07-31 |
Family
ID=29354898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979122875U Expired JPS5734766Y2 (cg-RX-API-DMAC7.html) | 1979-09-05 | 1979-09-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5734766Y2 (cg-RX-API-DMAC7.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61217344A (ja) * | 1986-02-18 | 1986-09-26 | 三菱油化バーデイッシェ株式会社 | 包装箱 |
| JPS61248730A (ja) * | 1985-04-27 | 1986-11-06 | Sekisui Plastics Co Ltd | 複合板紙の連続的製造方法 |
| JPH01237131A (ja) * | 1989-01-18 | 1989-09-21 | Ishizaki Sangyo Kk | 軟質プラスチックフォームシート貼り段ボール及びその製造方法 |
-
1979
- 1979-09-05 JP JP1979122875U patent/JPS5734766Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61248730A (ja) * | 1985-04-27 | 1986-11-06 | Sekisui Plastics Co Ltd | 複合板紙の連続的製造方法 |
| JPS61217344A (ja) * | 1986-02-18 | 1986-09-26 | 三菱油化バーデイッシェ株式会社 | 包装箱 |
| JPH01237131A (ja) * | 1989-01-18 | 1989-09-21 | Ishizaki Sangyo Kk | 軟質プラスチックフォームシート貼り段ボール及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5734766Y2 (cg-RX-API-DMAC7.html) | 1982-07-31 |