JPS5638061B2 - - Google Patents
Info
- Publication number
- JPS5638061B2 JPS5638061B2 JP12246176A JP12246176A JPS5638061B2 JP S5638061 B2 JPS5638061 B2 JP S5638061B2 JP 12246176 A JP12246176 A JP 12246176A JP 12246176 A JP12246176 A JP 12246176A JP S5638061 B2 JPS5638061 B2 JP S5638061B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12246176A JPS5347770A (en) | 1976-10-13 | 1976-10-13 | Production of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12246176A JPS5347770A (en) | 1976-10-13 | 1976-10-13 | Production of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5347770A JPS5347770A (en) | 1978-04-28 |
| JPS5638061B2 true JPS5638061B2 (fr) | 1981-09-03 |
Family
ID=14836420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12246176A Granted JPS5347770A (en) | 1976-10-13 | 1976-10-13 | Production of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5347770A (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5918438U (ja) * | 1982-07-27 | 1984-02-04 | シチズン時計株式会社 | 電子時計のｉｃ封止構造 |
| JPS59125841U (ja) * | 1983-02-15 | 1984-08-24 | 松下電器産業株式会社 | 半導体素子保護用樹脂の流れ止め |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4840663A (fr) * | 1971-09-29 | 1973-06-14 | ||
| JPS5310859U (fr) * | 1976-07-09 | 1978-01-30 |
-
1976
- 1976-10-13 JP JP12246176A patent/JPS5347770A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4840663A (fr) * | 1971-09-29 | 1973-06-14 | ||
| JPS5310859U (fr) * | 1976-07-09 | 1978-01-30 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5347770A (en) | 1978-04-28 |