JPS5638057B2 - - Google Patents
Info
- Publication number
- JPS5638057B2 JPS5638057B2 JP12252376A JP12252376A JPS5638057B2 JP S5638057 B2 JPS5638057 B2 JP S5638057B2 JP 12252376 A JP12252376 A JP 12252376A JP 12252376 A JP12252376 A JP 12252376A JP S5638057 B2 JPS5638057 B2 JP S5638057B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Formation Of Insulating Films (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12252376A JPS5347270A (en) | 1976-10-12 | 1976-10-12 | Semiconductor waver protecting film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12252376A JPS5347270A (en) | 1976-10-12 | 1976-10-12 | Semiconductor waver protecting film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5347270A JPS5347270A (en) | 1978-04-27 |
| JPS5638057B2 true JPS5638057B2 (ja) | 1981-09-03 |
Family
ID=14837949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12252376A Granted JPS5347270A (en) | 1976-10-12 | 1976-10-12 | Semiconductor waver protecting film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5347270A (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006527477A (ja) * | 2003-06-06 | 2006-11-30 | エグシル テクノロジー リミテッド | 界面活性剤膜を用いるレーザ切削加工 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57183033A (en) * | 1981-05-06 | 1982-11-11 | Toshiba Corp | Method for wafer exposure and device thereof |
| JP2004322168A (ja) * | 2003-04-25 | 2004-11-18 | Disco Abrasive Syst Ltd | レーザー加工装置 |
| JP6399923B2 (ja) * | 2014-12-24 | 2018-10-03 | 株式会社ディスコ | 板状物のレーザー加工方法 |
| EP3882959A4 (en) * | 2018-11-15 | 2022-08-17 | Tokyo Ohka Kogyo Co., Ltd. | PROTECTIVE FILM FORMING AGENT FOR PLASMA DICING AND SEMICONDUCTOR CHIP MANUFACTURING METHOD |
-
1976
- 1976-10-12 JP JP12252376A patent/JPS5347270A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006527477A (ja) * | 2003-06-06 | 2006-11-30 | エグシル テクノロジー リミテッド | 界面活性剤膜を用いるレーザ切削加工 |
| JP2012110964A (ja) * | 2003-06-06 | 2012-06-14 | Electro Scientific Industries Inc | 界面活性剤膜を用いるレーザ切削加工 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5347270A (en) | 1978-04-27 |