JPS5637247A - Semiconductor covering glass - Google Patents

Semiconductor covering glass

Info

Publication number
JPS5637247A
JPS5637247A JP11285479A JP11285479A JPS5637247A JP S5637247 A JPS5637247 A JP S5637247A JP 11285479 A JP11285479 A JP 11285479A JP 11285479 A JP11285479 A JP 11285479A JP S5637247 A JPS5637247 A JP S5637247A
Authority
JP
Japan
Prior art keywords
oxide
glass
resistance
acid resistance
covering glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11285479A
Other languages
Japanese (ja)
Other versions
JPS5950609B2 (en
Inventor
Takao Omori
Masami Osada
Shunichi Oota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Techno Glass Co Ltd
Original Assignee
Toshiba Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Glass Co Ltd filed Critical Toshiba Glass Co Ltd
Priority to JP11285479A priority Critical patent/JPS5950609B2/en
Publication of JPS5637247A publication Critical patent/JPS5637247A/en
Publication of JPS5950609B2 publication Critical patent/JPS5950609B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders

Abstract

PURPOSE: To considerably enhance the acid resistance, crack resistance and electrical characteristics of ZnO-B2O3-SiO2 glass required as semicondutor covering glass by adding Nb2O5.
CONSTITUTION: Glass is manufactured having a composition consisting of, by wt., 50W65% zinc oxide, 20W30% boron oxide, 6W12% silicon oxide, 1W5% niobium pentaoxide, 0W10% lead oxide, 0W3% aluminum oxide, 0W2% creium oxide and 0W2% antimony oxide. A semiconductor device requires acid resistance since a considerably strong acid soln. is used in electrode attachement, plating or other prosess. This glass has superior acid resistance as well as superior crack resistance and electrical charateristics, so it is suitable for use as semiconductor covering glass.
COPYRIGHT: (C)1981,JPO&Japio
JP11285479A 1979-09-05 1979-09-05 Glass for semiconductor coating Expired JPS5950609B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11285479A JPS5950609B2 (en) 1979-09-05 1979-09-05 Glass for semiconductor coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11285479A JPS5950609B2 (en) 1979-09-05 1979-09-05 Glass for semiconductor coating

Publications (2)

Publication Number Publication Date
JPS5637247A true JPS5637247A (en) 1981-04-10
JPS5950609B2 JPS5950609B2 (en) 1984-12-10

Family

ID=14597185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11285479A Expired JPS5950609B2 (en) 1979-09-05 1979-09-05 Glass for semiconductor coating

Country Status (1)

Country Link
JP (1) JPS5950609B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105541116A (en) * 2015-12-29 2016-05-04 江苏建达恩电子科技有限公司 Glass powder for wrapping electronic chip and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105541116A (en) * 2015-12-29 2016-05-04 江苏建达恩电子科技有限公司 Glass powder for wrapping electronic chip and preparation method thereof

Also Published As

Publication number Publication date
JPS5950609B2 (en) 1984-12-10

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