JPS5636239B2 - - Google Patents
Info
- Publication number
- JPS5636239B2 JPS5636239B2 JP6105971A JP6105971A JPS5636239B2 JP S5636239 B2 JPS5636239 B2 JP S5636239B2 JP 6105971 A JP6105971 A JP 6105971A JP 6105971 A JP6105971 A JP 6105971A JP S5636239 B2 JPS5636239 B2 JP S5636239B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6105971A JPS5636239B2 (cs) | 1971-08-13 | 1971-08-13 | |
| DE19722239676 DE2239676A1 (de) | 1971-08-13 | 1972-08-11 | Verfahren zum direkten stromlosen auftragen eines goldueberzugs |
| US05/546,923 US3993808A (en) | 1971-08-13 | 1975-02-04 | Method for electroless plating gold directly on tungsten or molybdenum |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6105971A JPS5636239B2 (cs) | 1971-08-13 | 1971-08-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4827929A JPS4827929A (cs) | 1973-04-13 |
| JPS5636239B2 true JPS5636239B2 (cs) | 1981-08-22 |
Family
ID=13160216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6105971A Expired JPS5636239B2 (cs) | 1971-08-13 | 1971-08-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5636239B2 (cs) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51129672A (en) * | 1975-04-11 | 1976-11-11 | Hitachi Chemical Co Ltd | Method of manufacturing ceramic circuit board |
| JP2765000B2 (ja) * | 1989-02-14 | 1998-06-11 | 株式会社ワールドメタル | セラミック配線板 |
| JP2704932B2 (ja) * | 1993-03-11 | 1998-01-26 | 東京タングステン株式会社 | 放熱基板およびその製造方法ならびに半導体装置 |
-
1971
- 1971-08-13 JP JP6105971A patent/JPS5636239B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4827929A (cs) | 1973-04-13 |