JPS5636162U - - Google Patents
Info
- Publication number
- JPS5636162U JPS5636162U JP1979119769U JP11976979U JPS5636162U JP S5636162 U JPS5636162 U JP S5636162U JP 1979119769 U JP1979119769 U JP 1979119769U JP 11976979 U JP11976979 U JP 11976979U JP S5636162 U JPS5636162 U JP S5636162U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979119769U JPS6020943Y2 (ja) | 1979-08-29 | 1979-08-29 | 半導体装置 |
| US06/182,404 US4392151A (en) | 1979-08-29 | 1980-08-26 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979119769U JPS6020943Y2 (ja) | 1979-08-29 | 1979-08-29 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5636162U true JPS5636162U (US07122547-20061017-C00273.png) | 1981-04-07 |
| JPS6020943Y2 JPS6020943Y2 (ja) | 1985-06-22 |
Family
ID=14769731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979119769U Expired JPS6020943Y2 (ja) | 1979-08-29 | 1979-08-29 | 半導体装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4392151A (US07122547-20061017-C00273.png) |
| JP (1) | JPS6020943Y2 (US07122547-20061017-C00273.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61182101U (US07122547-20061017-C00273.png) * | 1985-05-02 | 1986-11-13 |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5746662A (en) * | 1980-09-04 | 1982-03-17 | Toshiba Corp | Semiconductor rectifier |
| JPH0740600B2 (ja) * | 1987-04-30 | 1995-05-01 | 三菱電機株式会社 | 半導体装置 |
| JPH02155256A (ja) * | 1988-12-08 | 1990-06-14 | Mitsubishi Electric Corp | 半導体装置 |
| EP0400177A1 (de) * | 1989-05-31 | 1990-12-05 | Siemens Aktiengesellschaft | Verbindung eines Halbleiterbauelements mit einem Metallträger |
| DE4115043A1 (de) * | 1991-05-08 | 1997-07-17 | Gen Electric | Dichtgepackte Verbindungsstruktur, die eine Kammer enthält |
| JP2907186B2 (ja) * | 1997-05-19 | 1999-06-21 | 日本電気株式会社 | 半導体装置、その製造方法 |
| JP3003638B2 (ja) * | 1997-08-05 | 2000-01-31 | 日本電気株式会社 | 半導体装置、その製造方法 |
| JP3939429B2 (ja) | 1998-04-02 | 2007-07-04 | 沖電気工業株式会社 | 半導体装置 |
| US6949824B1 (en) * | 2000-04-12 | 2005-09-27 | Micron Technology, Inc. | Internal package heat dissipator |
| US6930397B2 (en) | 2001-03-28 | 2005-08-16 | International Rectifier Corporation | Surface mounted package with die bottom spaced from support board |
| US7476964B2 (en) * | 2001-06-18 | 2009-01-13 | International Rectifier Corporation | High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing |
| US6784540B2 (en) | 2001-10-10 | 2004-08-31 | International Rectifier Corp. | Semiconductor device package with improved cooling |
| US7579697B2 (en) | 2002-07-15 | 2009-08-25 | International Rectifier Corporation | Arrangement for high frequency application |
| US20050269677A1 (en) * | 2004-05-28 | 2005-12-08 | Martin Standing | Preparation of front contact for surface mounting |
| JP4538359B2 (ja) * | 2005-03-31 | 2010-09-08 | 株式会社日立産機システム | 電気回路モジュール |
| US7230333B2 (en) | 2005-04-21 | 2007-06-12 | International Rectifier Corporation | Semiconductor package |
| TWI365516B (en) * | 2005-04-22 | 2012-06-01 | Int Rectifier Corp | Chip-scale package |
| TW201011869A (en) * | 2008-09-10 | 2010-03-16 | Cyntec Co Ltd | Chip package structure |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3763403A (en) * | 1972-03-01 | 1973-10-02 | Gen Electric | Isolated heat-sink semiconductor device |
| JPS4943722U (US07122547-20061017-C00273.png) * | 1972-07-21 | 1974-04-17 | ||
| US3820153A (en) * | 1972-08-28 | 1974-06-25 | Zyrotron Ind Inc | Plurality of semiconductor elements mounted on common base |
| JPS50137445A (US07122547-20061017-C00273.png) * | 1974-04-18 | 1975-10-31 | ||
| US3920114A (en) * | 1974-09-09 | 1975-11-18 | Scm Corp | Release and blocking mechanism for power operated typewriters |
| DE2610136A1 (de) * | 1976-03-11 | 1977-09-22 | Bosch Gmbh Robert | Spannungsregler fuer generatoren |
| JPS5315763A (en) * | 1976-07-28 | 1978-02-14 | Hitachi Ltd | Resin sealed type semiconductor device |
| US4330790A (en) * | 1980-03-24 | 1982-05-18 | National Semiconductor Corporation | Tape operated semiconductor device packaging |
-
1979
- 1979-08-29 JP JP1979119769U patent/JPS6020943Y2/ja not_active Expired
-
1980
- 1980-08-26 US US06/182,404 patent/US4392151A/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61182101U (US07122547-20061017-C00273.png) * | 1985-05-02 | 1986-11-13 | ||
| JPH0233365Y2 (US07122547-20061017-C00273.png) * | 1985-05-02 | 1990-09-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6020943Y2 (ja) | 1985-06-22 |
| US4392151A (en) | 1983-07-05 |
