JPS5629331A - Water rinsing device - Google Patents
Water rinsing deviceInfo
- Publication number
- JPS5629331A JPS5629331A JP10536979A JP10536979A JPS5629331A JP S5629331 A JPS5629331 A JP S5629331A JP 10536979 A JP10536979 A JP 10536979A JP 10536979 A JP10536979 A JP 10536979A JP S5629331 A JPS5629331 A JP S5629331A
- Authority
- JP
- Japan
- Prior art keywords
- rinsing
- water
- shower
- nitrogen gas
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
PURPOSE:To always preferably and effectively rinse in shower in a water rinsing device by preparing an atmosphere which is necessary to retain the purity of rinsing water in a rinsing tank when rinsing in the tank. CONSTITUTION:After spraying rinsing water such as highly pure water from spraying tubes 2 starts spraying, a cover 6 is closed, and nitrogen gas is injected from an injection tube 7 to retain nitrogen gas atmosphere in a rinsing tank 1 during shower rinsing. Air purified through gas adsorber such as activated charcoal is injected instead of the nitrogen gas. In this manner it can always preferably and effectively rinse in shower.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10536979A JPS5629331A (en) | 1979-08-18 | 1979-08-18 | Water rinsing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10536979A JPS5629331A (en) | 1979-08-18 | 1979-08-18 | Water rinsing device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5629331A true JPS5629331A (en) | 1981-03-24 |
Family
ID=14405789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10536979A Pending JPS5629331A (en) | 1979-08-18 | 1979-08-18 | Water rinsing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5629331A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60246639A (en) * | 1984-05-21 | 1985-12-06 | Fujitsu Ltd | Wet processing method for wafer |
US5261431A (en) * | 1991-04-02 | 1993-11-16 | Tokyo Electron Limited | Washing apparatus |
-
1979
- 1979-08-18 JP JP10536979A patent/JPS5629331A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60246639A (en) * | 1984-05-21 | 1985-12-06 | Fujitsu Ltd | Wet processing method for wafer |
US5261431A (en) * | 1991-04-02 | 1993-11-16 | Tokyo Electron Limited | Washing apparatus |
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