JPS5627594B2 - - Google Patents
Info
- Publication number
- JPS5627594B2 JPS5627594B2 JP3014775A JP3014775A JPS5627594B2 JP S5627594 B2 JPS5627594 B2 JP S5627594B2 JP 3014775 A JP3014775 A JP 3014775A JP 3014775 A JP3014775 A JP 3014775A JP S5627594 B2 JPS5627594 B2 JP S5627594B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3014775A JPS5627594B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-03-14 | 1975-03-14 | |
| US05/665,708 US4099974A (en) | 1975-03-14 | 1976-03-10 | Electroless copper solution |
| DE2610470A DE2610470C3 (de) | 1975-03-14 | 1976-03-12 | Verfahren zur stromlosen Abscheidung von Kupferschichten |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3014775A JPS5627594B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-03-14 | 1975-03-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51105932A JPS51105932A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1976-09-20 |
| JPS5627594B2 true JPS5627594B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1981-06-25 |
Family
ID=12295640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3014775A Expired JPS5627594B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-03-14 | 1975-03-14 |
Country Status (3)
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4303443A (en) * | 1979-06-15 | 1981-12-01 | Hitachi, Ltd. | Electroless copper plating solution |
| JPS56156749A (en) * | 1980-05-08 | 1981-12-03 | Toshiba Corp | Chemical copper plating solution |
| JPS5716158A (en) * | 1980-06-30 | 1982-01-27 | Matsushita Electric Ind Co Ltd | Copper electroless plating liquid |
| WO1982000666A1 (en) * | 1980-08-12 | 1982-03-04 | Macdermid Inc | Method for continuous metal deposition from a non-autocatalytic electroless plating bath using electric potential |
| US4459184A (en) * | 1980-08-12 | 1984-07-10 | Macdermid, Inc. | Method for continuous metal deposition from a non-autocatalytic electroless plating bath using electric potential |
| JPS605079B2 (ja) * | 1980-09-02 | 1985-02-08 | 株式会社日立製作所 | プリント基板の製造方法 |
| JPS5830760B2 (ja) * | 1980-10-09 | 1983-07-01 | 株式会社日立製作所 | プリント回路板の製法 |
| JPS5923862A (ja) * | 1982-07-29 | 1984-02-07 | Nec Corp | 無電解銅めつき液およびその製造方法 |
| US4548644A (en) * | 1982-09-28 | 1985-10-22 | Hitachi Chemical Company, Ltd. | Electroless copper deposition solution |
| JPS59172702U (ja) * | 1983-05-02 | 1984-11-19 | 三浦 芳明 | スナツプ・ワイシヤツ |
| JPS6033358A (ja) * | 1983-08-04 | 1985-02-20 | Hitachi Chem Co Ltd | 無電解銅めっき液 |
| US4908242A (en) * | 1986-10-31 | 1990-03-13 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
| ES2039403T3 (es) * | 1986-10-31 | 1993-10-01 | Amp-Akzo Corporation (A Delaware Corp.) | Metodo para depositar sin electricidad cobre de alta calidad. |
| US4818286A (en) * | 1988-03-08 | 1989-04-04 | International Business Machines Corporation | Electroless copper plating bath |
| JPH0454278A (ja) * | 1990-06-22 | 1992-02-21 | Mitsubishi Electric Corp | 内燃機関用点火装置 |
| US5158604A (en) * | 1991-07-01 | 1992-10-27 | Monsanto Company | Viscous electroless plating solutions |
| US5306336A (en) * | 1992-11-20 | 1994-04-26 | Monsanto Company | Sulfate-free electroless copper plating baths |
| DE4440299A1 (de) * | 1994-11-11 | 1996-05-15 | Metallgesellschaft Ag | Verfahren zur stromlosen Abscheidung von Kupferüberzügen auf Eisen- und Eisenlegierungsoberflächen |
| JP3986743B2 (ja) * | 2000-10-03 | 2007-10-03 | 株式会社日立製作所 | 配線基板とその製造方法及びそれに用いる無電解銅めっき液 |
| TWI348499B (en) * | 2006-07-07 | 2011-09-11 | Rohm & Haas Elect Mat | Electroless copper and redox couples |
| EP1876262A1 (en) * | 2006-07-07 | 2008-01-09 | Rohm and Haas Electronic Materials, L.L.C. | Environmentally friendly electroless copper compositions |
| EP1876260B1 (en) * | 2006-07-07 | 2018-11-28 | Rohm and Haas Electronic Materials LLC | Improved electroless copper compositions |
| TWI347373B (en) * | 2006-07-07 | 2011-08-21 | Rohm & Haas Elect Mat | Formaldehyde free electroless copper compositions |
| KR20080083790A (ko) * | 2007-03-13 | 2008-09-19 | 삼성전자주식회사 | 무전해 구리 도금액, 그의 제조방법 및 무전해 구리도금방법 |
| KR101036091B1 (ko) * | 2008-11-24 | 2011-05-19 | 삼성에스디아이 주식회사 | 이차 전지용 회로기판 및 이를 구비하는 이차 전지 |
| JP5255015B2 (ja) * | 2010-04-28 | 2013-08-07 | 名古屋メッキ工業株式会社 | 高分子繊維の無電解銅めっき方法 |
| CN108777915B (zh) * | 2017-05-30 | 2021-07-23 | 杨军 | 在多孔基底上制造高导电特性铜-纤维混合物的方法 |
| CN118910596A (zh) * | 2024-06-25 | 2024-11-08 | 广东工业大学 | 一种激光诱导液相沉积镀铜的溶液配方的制备方法、溶液配方和镀铜方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3377174A (en) * | 1963-10-24 | 1968-04-09 | Torigai Eiichi | Method and bath for chemically plating copper |
| US3472664A (en) * | 1966-09-15 | 1969-10-14 | Enthone | Inhibiting stardusting in electroless copper plating |
| FR1600458A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1967-10-27 | 1970-07-27 | ||
| US3615736A (en) * | 1969-01-06 | 1971-10-26 | Enthone | Electroless copper plating bath |
| US3607317A (en) * | 1969-02-04 | 1971-09-21 | Photocircuits Corp | Ductility promoter and stabilizer for electroless copper plating baths |
| BE757573A (fr) * | 1969-10-16 | 1971-04-15 | Philips Nv | Depot sans courant de cuivre flexible |
-
1975
- 1975-03-14 JP JP3014775A patent/JPS5627594B2/ja not_active Expired
-
1976
- 1976-03-10 US US05/665,708 patent/US4099974A/en not_active Expired - Lifetime
- 1976-03-12 DE DE2610470A patent/DE2610470C3/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2610470A1 (de) | 1976-09-30 |
| DE2610470B2 (de) | 1978-02-16 |
| US4099974A (en) | 1978-07-11 |
| DE2610470C3 (de) | 1983-02-24 |
| JPS51105932A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1976-09-20 |