JPS5624713B2 - - Google Patents
Info
- Publication number
- JPS5624713B2 JPS5624713B2 JP5607274A JP5607274A JPS5624713B2 JP S5624713 B2 JPS5624713 B2 JP S5624713B2 JP 5607274 A JP5607274 A JP 5607274A JP 5607274 A JP5607274 A JP 5607274A JP S5624713 B2 JPS5624713 B2 JP S5624713B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US382056A US3917486A (en) | 1973-07-24 | 1973-07-24 | Immersion tin bath composition and process for using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5033935A JPS5033935A (US07655688-20100202-C00086.png) | 1975-04-02 |
| JPS5624713B2 true JPS5624713B2 (US07655688-20100202-C00086.png) | 1981-06-08 |
Family
ID=23507363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5607274A Expired JPS5624713B2 (US07655688-20100202-C00086.png) | 1973-07-24 | 1974-05-17 |
Country Status (11)
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0453710U (US07655688-20100202-C00086.png) * | 1990-09-11 | 1992-05-08 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4170525A (en) * | 1978-04-28 | 1979-10-09 | Gould Inc. | Process for plating a composite structure |
| US4381228A (en) * | 1981-06-16 | 1983-04-26 | Occidental Chemical Corporation | Process and composition for the electrodeposition of tin and tin alloys |
| US4405663A (en) * | 1982-03-29 | 1983-09-20 | Republic Steel Corporation | Tin plating bath composition and process |
| IL81530A0 (en) * | 1987-02-10 | 1987-09-16 | Techno Chemica Ltd | Tin coating immersion solution and coating process using the same |
| US5196053A (en) * | 1991-11-27 | 1993-03-23 | Mcgean-Rohco, Inc. | Complexing agent for displacement tin plating |
| US5562950A (en) * | 1994-03-24 | 1996-10-08 | Novamax Technologies, Inc. | Tin coating composition and method |
| EP2298960A1 (en) * | 2009-08-24 | 2011-03-23 | ATOTECH Deutschland GmbH | Method for electroless plating of tin and tin alloys |
| CN103540972A (zh) * | 2013-10-29 | 2014-01-29 | 常熟市伟达电镀有限责任公司 | 高硬度的电镀液 |
| JP6980017B2 (ja) | 2016-12-28 | 2021-12-15 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH | 錫めっき浴および錫もしくは錫合金を基材の表面に析出させる方法 |
| US10774425B2 (en) | 2017-05-30 | 2020-09-15 | Macdermid Enthone Inc. | Elimination of H2S in immersion tin plating solution |
| EP3800277B1 (en) * | 2019-10-02 | 2023-05-10 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for performing immersion tin process in the production of a component carrier |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2369620A (en) * | 1941-03-07 | 1945-02-13 | Battelle Development Corp | Method of coating cupreous metal with tin |
| US2891871A (en) * | 1956-09-21 | 1959-06-23 | Westinghouse Electric Corp | Tin immersion plating composition and process for using the same |
| US3303029A (en) * | 1964-01-23 | 1967-02-07 | Shipley Co | Tin coating of copper surfaces by replacement plating |
| US3672923A (en) * | 1970-06-29 | 1972-06-27 | Kollmorgen Corp | Solid precious metal sensitizing compositions |
-
1973
- 1973-07-24 US US382056A patent/US3917486A/en not_active Expired - Lifetime
-
1974
- 1974-04-26 CA CA199,110A patent/CA1037207A/en not_active Expired
- 1974-05-17 JP JP5607274A patent/JPS5624713B2/ja not_active Expired
- 1974-07-11 CH CH958174A patent/CH606499A5/xx not_active IP Right Cessation
- 1974-07-15 GB GB3120874A patent/GB1436645A/en not_active Expired
- 1974-07-19 FR FR7425180A patent/FR2238772B1/fr not_active Expired
- 1974-07-22 SE SE7409520A patent/SE411228B/xx unknown
- 1974-07-23 DK DK397374A patent/DK397374A/da not_active Application Discontinuation
- 1974-07-23 IT IT52221/74A patent/IT1016948B/it active
- 1974-07-24 NL NL7410019A patent/NL7410019A/xx not_active Application Discontinuation
- 1974-07-24 AT AT609174A patent/AT332188B/de not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0453710U (US07655688-20100202-C00086.png) * | 1990-09-11 | 1992-05-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| ATA609174A (de) | 1975-12-15 |
| SE411228B (sv) | 1979-12-10 |
| DE2433820B2 (de) | 1977-04-28 |
| IT1016948B (it) | 1977-06-20 |
| FR2238772B1 (US07655688-20100202-C00086.png) | 1978-03-24 |
| AT332188B (de) | 1976-09-10 |
| NL7410019A (nl) | 1975-01-28 |
| SE7409520L (US07655688-20100202-C00086.png) | 1975-01-27 |
| CA1037207A (en) | 1978-08-29 |
| AU6664174A (en) | 1975-09-18 |
| US3917486A (en) | 1975-11-04 |
| DK397374A (US07655688-20100202-C00086.png) | 1975-03-03 |
| DE2433820A1 (de) | 1975-01-30 |
| GB1436645A (en) | 1976-05-19 |
| CH606499A5 (US07655688-20100202-C00086.png) | 1978-10-31 |
| JPS5033935A (US07655688-20100202-C00086.png) | 1975-04-02 |
| FR2238772A1 (US07655688-20100202-C00086.png) | 1975-02-21 |
