JPS5624032B1 - - Google Patents

Info

Publication number
JPS5624032B1
JPS5624032B1 JP769972A JP769972A JPS5624032B1 JP S5624032 B1 JPS5624032 B1 JP S5624032B1 JP 769972 A JP769972 A JP 769972A JP 769972 A JP769972 A JP 769972A JP S5624032 B1 JPS5624032 B1 JP S5624032B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP769972A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5624032B1 publication Critical patent/JPS5624032B1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1619Apparatus for electroless plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1655Process features
    • C23C18/1662Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Chemically Coating (AREA)
JP769972A 1971-01-25 1972-01-21 Pending JPS5624032B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00103355A US3853094A (en) 1971-01-25 1971-01-25 Electroless plating apparatus

Publications (1)

Publication Number Publication Date
JPS5624032B1 true JPS5624032B1 (en) 1981-06-03

Family

ID=22294742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP769972A Pending JPS5624032B1 (en) 1971-01-25 1972-01-21

Country Status (11)

Country Link
US (1) US3853094A (en)
JP (1) JPS5624032B1 (en)
AU (1) AU469973B2 (en)
BE (1) BE778401A (en)
CA (1) CA962537A (en)
CH (1) CH585277A5 (en)
FR (1) FR2123369B1 (en)
GB (1) GB1382101A (en)
IE (1) IE35988B1 (en)
IT (1) IT946624B (en)
NL (1) NL7201005A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57200057U (en) * 1981-06-15 1982-12-20
JPS5874363U (en) * 1981-11-13 1983-05-19 リコーエレメックス株式会社 Circuit board mounting structure

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2443238B2 (en) * 1974-09-10 1980-03-20 Fag Kugelfischer Georg Schaefer & Co, 8720 Schweinfurt Friction rotor for frictional false twisting of synthetic threads
US4150180A (en) * 1975-12-08 1979-04-17 Potapov Fedor P Method for chemical nickel-plating of parts having a catalytic surface employing a vessel having an upper heated zone and a lower cooled zone
US4063564A (en) * 1976-08-30 1977-12-20 Francis Theodore R Vibratory cleaning and coating system
US4328266A (en) * 1977-06-06 1982-05-04 Surface Technology, Inc. Method for rendering non-platable substrates platable
US4262044A (en) * 1980-05-16 1981-04-14 Kuczma Jr John J Method for the electroless nickel plating of long bodies
US5114751A (en) * 1989-10-24 1992-05-19 Henkel Corporation Application of an organic coating to small metal articles
GB2246145A (en) * 1990-07-18 1992-01-22 Nippon Piston Ring Co Ltd Nickel-born alloy composite slidable surface
US5417829A (en) * 1993-10-08 1995-05-23 Tumbleveyor, Inc. Apparatus for the surface treatment of parts
US5415890A (en) * 1994-01-03 1995-05-16 Eaton Corporation Modular apparatus and method for surface treatment of parts with liquid baths
US6936142B2 (en) * 1997-12-22 2005-08-30 George Hradil Spouted bed apparatus for contacting objects with a fluid
US20050217989A1 (en) * 1997-12-22 2005-10-06 George Hradil Spouted bed apparatus with annular region for electroplating small objects
US6193858B1 (en) * 1997-12-22 2001-02-27 George Hradil Spouted bed apparatus for contacting objects with a fluid
US6309583B1 (en) * 1999-08-02 2001-10-30 Surface Technology, Inc. Composite coatings for thermal properties
US7138014B2 (en) * 2002-01-28 2006-11-21 Applied Materials, Inc. Electroless deposition apparatus
IT1397144B1 (en) * 2009-11-30 2013-01-04 Nuovo Pignone Spa PLATED SUBSTRATE NOT ELECTRICALLY COMPOSED OF NICKEL AND METHOD.

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4829695A (en) * 1971-08-23 1973-04-19

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2165364A (en) * 1938-01-19 1939-07-11 Fernplas Corp Method of and apparatus for coating articles by dipping
US2908249A (en) * 1957-05-14 1959-10-13 Westinghouse Electric Corp Apparatus for uniformly coating photoflash lamps
US3025828A (en) * 1960-05-05 1962-03-20 Du Pont Coating apparatus
US3336906A (en) * 1965-06-09 1967-08-22 Fairchild Camera Instr Co Apparatus for immersion development
DE1621206B2 (en) * 1967-01-18 1971-12-16 Friedr. Blasberg Gmbh & Co, Kg, 5650 Solingen PROCESS FOR COATING WITH SLIDING FRICTION ON WORKPIECES STRESSED BY WEAR

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4829695A (en) * 1971-08-23 1973-04-19

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57200057U (en) * 1981-06-15 1982-12-20
JPS5874363U (en) * 1981-11-13 1983-05-19 リコーエレメックス株式会社 Circuit board mounting structure

Also Published As

Publication number Publication date
AU469973B2 (en) 1976-02-26
FR2123369B1 (en) 1977-04-01
IE35988L (en) 1972-07-25
FR2123369A1 (en) 1972-09-08
CA962537A (en) 1975-02-11
NL7201005A (en) 1972-07-27
US3853094A (en) 1974-12-10
IE35988B1 (en) 1976-07-21
AU3815772A (en) 1973-07-26
DE2203230A1 (en) 1972-08-03
DE2203230B2 (en) 1976-04-15
CH585277A5 (en) 1977-02-28
BE778401A (en) 1972-07-24
IT946624B (en) 1973-05-21
GB1382101A (en) 1975-01-29

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