IE35988L - Electroless plating - Google Patents
Electroless platingInfo
- Publication number
- IE35988L IE35988L IE720069A IE6972A IE35988L IE 35988 L IE35988 L IE 35988L IE 720069 A IE720069 A IE 720069A IE 6972 A IE6972 A IE 6972A IE 35988 L IE35988 L IE 35988L
- Authority
- IE
- Ireland
- Prior art keywords
- electroless plating
- plating
- us3853094a
- concomitant
- plated
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Method and apparatus for concomitant particulate deposition in electroless plating, and the product thereof, wherein objects to be plated are subjected to tumbling during the plating process.
[US3853094A]
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US00103355A US3853094A (en) | 1971-01-25 | 1971-01-25 | Electroless plating apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
IE35988L true IE35988L (en) | 1972-07-25 |
IE35988B1 IE35988B1 (en) | 1976-07-21 |
Family
ID=22294742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IE69/72A IE35988B1 (en) | 1971-01-25 | 1972-01-18 | Electroless plating |
Country Status (11)
Country | Link |
---|---|
US (1) | US3853094A (en) |
JP (1) | JPS5624032B1 (en) |
AU (1) | AU469973B2 (en) |
BE (1) | BE778401A (en) |
CA (1) | CA962537A (en) |
CH (1) | CH585277A5 (en) |
FR (1) | FR2123369B1 (en) |
GB (1) | GB1382101A (en) |
IE (1) | IE35988B1 (en) |
IT (1) | IT946624B (en) |
NL (1) | NL7201005A (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2443238B2 (en) * | 1974-09-10 | 1980-03-20 | Fag Kugelfischer Georg Schaefer & Co, 8720 Schweinfurt | Friction rotor for frictional false twisting of synthetic threads |
US4150180A (en) * | 1975-12-08 | 1979-04-17 | Potapov Fedor P | Method for chemical nickel-plating of parts having a catalytic surface employing a vessel having an upper heated zone and a lower cooled zone |
US4063564A (en) * | 1976-08-30 | 1977-12-20 | Francis Theodore R | Vibratory cleaning and coating system |
US4328266A (en) * | 1977-06-06 | 1982-05-04 | Surface Technology, Inc. | Method for rendering non-platable substrates platable |
US4262044A (en) * | 1980-05-16 | 1981-04-14 | Kuczma Jr John J | Method for the electroless nickel plating of long bodies |
JPS57200057U (en) * | 1981-06-15 | 1982-12-20 | ||
JPS5874363U (en) * | 1981-11-13 | 1983-05-19 | リコーエレメックス株式会社 | Circuit board mounting structure |
US5114751A (en) * | 1989-10-24 | 1992-05-19 | Henkel Corporation | Application of an organic coating to small metal articles |
GB2246145A (en) * | 1990-07-18 | 1992-01-22 | Nippon Piston Ring Co Ltd | Nickel-born alloy composite slidable surface |
US5417829A (en) * | 1993-10-08 | 1995-05-23 | Tumbleveyor, Inc. | Apparatus for the surface treatment of parts |
US5415890A (en) * | 1994-01-03 | 1995-05-16 | Eaton Corporation | Modular apparatus and method for surface treatment of parts with liquid baths |
US6936142B2 (en) * | 1997-12-22 | 2005-08-30 | George Hradil | Spouted bed apparatus for contacting objects with a fluid |
US6193858B1 (en) * | 1997-12-22 | 2001-02-27 | George Hradil | Spouted bed apparatus for contacting objects with a fluid |
US20050217989A1 (en) * | 1997-12-22 | 2005-10-06 | George Hradil | Spouted bed apparatus with annular region for electroplating small objects |
US6309583B1 (en) * | 1999-08-02 | 2001-10-30 | Surface Technology, Inc. | Composite coatings for thermal properties |
US7138014B2 (en) * | 2002-01-28 | 2006-11-21 | Applied Materials, Inc. | Electroless deposition apparatus |
IT1397144B1 (en) * | 2009-11-30 | 2013-01-04 | Nuovo Pignone Spa | PLATED SUBSTRATE NOT ELECTRICALLY COMPOSED OF NICKEL AND METHOD. |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2165364A (en) * | 1938-01-19 | 1939-07-11 | Fernplas Corp | Method of and apparatus for coating articles by dipping |
US2908249A (en) * | 1957-05-14 | 1959-10-13 | Westinghouse Electric Corp | Apparatus for uniformly coating photoflash lamps |
US3025828A (en) * | 1960-05-05 | 1962-03-20 | Du Pont | Coating apparatus |
US3336906A (en) * | 1965-06-09 | 1967-08-22 | Fairchild Camera Instr Co | Apparatus for immersion development |
DE1621206B2 (en) * | 1967-01-18 | 1971-12-16 | Friedr. Blasberg Gmbh & Co, Kg, 5650 Solingen | PROCESS FOR COATING WITH SLIDING FRICTION ON WORKPIECES STRESSED BY WEAR |
JPS4829695A (en) * | 1971-08-23 | 1973-04-19 |
-
1971
- 1971-01-25 US US00103355A patent/US3853094A/en not_active Expired - Lifetime
-
1972
- 1972-01-06 CA CA131,852A patent/CA962537A/en not_active Expired
- 1972-01-15 IT IT19428/72A patent/IT946624B/en active
- 1972-01-18 IE IE69/72A patent/IE35988B1/en unknown
- 1972-01-21 CH CH93572A patent/CH585277A5/xx not_active IP Right Cessation
- 1972-01-21 JP JP769972A patent/JPS5624032B1/ja active Pending
- 1972-01-21 GB GB308872A patent/GB1382101A/en not_active Expired
- 1972-01-21 AU AU38157/72A patent/AU469973B2/en not_active Expired
- 1972-01-24 BE BE778401A patent/BE778401A/en not_active IP Right Cessation
- 1972-01-24 FR FR7202225A patent/FR2123369B1/fr not_active Expired
- 1972-01-25 NL NL7201005A patent/NL7201005A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
AU3815772A (en) | 1973-07-26 |
BE778401A (en) | 1972-07-24 |
NL7201005A (en) | 1972-07-27 |
JPS5624032B1 (en) | 1981-06-03 |
IT946624B (en) | 1973-05-21 |
IE35988B1 (en) | 1976-07-21 |
GB1382101A (en) | 1975-01-29 |
DE2203230A1 (en) | 1972-08-03 |
FR2123369B1 (en) | 1977-04-01 |
DE2203230B2 (en) | 1976-04-15 |
CH585277A5 (en) | 1977-02-28 |
AU469973B2 (en) | 1976-02-26 |
FR2123369A1 (en) | 1972-09-08 |
CA962537A (en) | 1975-02-11 |
US3853094A (en) | 1974-12-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IE35988L (en) | Electroless plating | |
CA976043A (en) | Activation method for electroless plating | |
CA999708A (en) | Binding strap, and process as well as apparatus for manufacturing same | |
CA1021629A (en) | Process for producing fruit flakes or wafers, and fruit flakes or wafers produced in accordance therewith | |
CA989105A (en) | Electroless copper plating solution and process | |
CA969703A (en) | Electroless gold plating bath and process | |
AU1766570A (en) | Process and apparatus for depositing filaments to produce mats | |
YU34112B (en) | Process for preparing the (10)-methylester of nonadecapentene-(1,6,9,13,18)-carboxylic acid in the presence of a zerovalent nickel complex | |
CA963340A (en) | Paring process and machine | |
AU463714B2 (en) | Electroless plating process for cobalt coatings | |
CS182812B2 (en) | Method and device for making the chipboards,in particular of small thickness | |
CA1008721A (en) | Process and apparatus for coating food articles | |
AU1115170A (en) | Method and apparatus for depositing aerated food products | |
BG32001A1 (en) | Method and apparatus for continuous turning over of plane progessing articles, especially of furniture parts | |
CA1001110A (en) | Method and apparatus for electroplating metal articles | |
CA980716A (en) | Method and apparatus for bar electroplating | |
CA813312A (en) | Process for plating on cast, malleable, carburized, and carbonitrided irons | |
KR780000123B1 (en) | Water - soluale reactike monoazo dyestuffs, copper complex compounds thereof and process for thein preparation | |
CA893822A (en) | Apparatus and method for plating articles | |
CA830987A (en) | Water-soluble, metal-containing azo-dyestuffs and process for preparing them | |
CA785673A (en) | Chemical plating solution, process and product | |
AU448668B2 (en) | Electroless plating solution and process | |
CA825392A (en) | Method and apparatus for chilling articles, especially food items | |
CA816623A (en) | Process and apparatus for making ceramic articles, and product | |
CA872949A (en) | Electroplating bath, process of using the same, and product thereof |