JPS5617434B2 - - Google Patents

Info

Publication number
JPS5617434B2
JPS5617434B2 JP6503079A JP6503079A JPS5617434B2 JP S5617434 B2 JPS5617434 B2 JP S5617434B2 JP 6503079 A JP6503079 A JP 6503079A JP 6503079 A JP6503079 A JP 6503079A JP S5617434 B2 JPS5617434 B2 JP S5617434B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6503079A
Other languages
Japanese (ja)
Other versions
JPS55158275A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6503079A priority Critical patent/JPS55158275A/ja
Priority to US06/148,283 priority patent/US4308089A/en
Priority to EP80102980A priority patent/EP0019915B1/en
Priority to DE8080102980T priority patent/DE3069207D1/de
Publication of JPS55158275A publication Critical patent/JPS55158275A/ja
Publication of JPS5617434B2 publication Critical patent/JPS5617434B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P70/273—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
    • H10P95/00—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP6503079A 1979-05-28 1979-05-28 Corrosion preventing method for al and al alloy Granted JPS55158275A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP6503079A JPS55158275A (en) 1979-05-28 1979-05-28 Corrosion preventing method for al and al alloy
US06/148,283 US4308089A (en) 1979-05-28 1980-05-09 Method for preventing corrosion of Al and Al alloys
EP80102980A EP0019915B1 (en) 1979-05-28 1980-05-28 Method for preventing the corrosion of al and al alloys
DE8080102980T DE3069207D1 (en) 1979-05-28 1980-05-28 Method for preventing the corrosion of al and al alloys

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6503079A JPS55158275A (en) 1979-05-28 1979-05-28 Corrosion preventing method for al and al alloy

Publications (2)

Publication Number Publication Date
JPS55158275A JPS55158275A (en) 1980-12-09
JPS5617434B2 true JPS5617434B2 (OSRAM) 1981-04-22

Family

ID=13275163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6503079A Granted JPS55158275A (en) 1979-05-28 1979-05-28 Corrosion preventing method for al and al alloy

Country Status (4)

Country Link
US (1) US4308089A (OSRAM)
EP (1) EP0019915B1 (OSRAM)
JP (1) JPS55158275A (OSRAM)
DE (1) DE3069207D1 (OSRAM)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4380488A (en) * 1980-10-14 1983-04-19 Branson International Plasma Corporation Process and gas mixture for etching aluminum
JPS57204186A (en) * 1981-06-10 1982-12-14 Hitachi Ltd Electrode processing method for magnetic reluctance element
US4368220A (en) * 1981-06-30 1983-01-11 International Business Machines Corporation Passivation of RIE patterned al-based alloy films by etching to remove contaminants and surface oxide followed by oxidation
US4351696A (en) * 1981-10-28 1982-09-28 Fairchild Camera & Instrument Corp. Corrosion inhibition of aluminum or aluminum alloy film utilizing bromine-containing plasma
US4370195A (en) * 1982-03-25 1983-01-25 Rca Corporation Removal of plasma etching residues
US4450042A (en) * 1982-07-06 1984-05-22 Texas Instruments Incorporated Plasma etch chemistry for anisotropic etching of silicon
JPS59189633A (ja) * 1983-04-13 1984-10-27 Fujitsu Ltd 半導体装置の製造方法
JPS6077429A (ja) * 1983-10-04 1985-05-02 Asahi Glass Co Ltd ドライエツチング方法
US4552783A (en) * 1984-11-05 1985-11-12 General Electric Company Enhancing the selectivity of tungsten deposition on conductor and semiconductor surfaces
US5868854A (en) * 1989-02-27 1999-02-09 Hitachi, Ltd. Method and apparatus for processing samples
JP2663704B2 (ja) * 1990-10-30 1997-10-15 日本電気株式会社 Ａｌ合金の腐食防止法
US5126008A (en) * 1991-05-03 1992-06-30 Applied Materials, Inc. Corrosion-free aluminum etching process for fabricating an integrated circuit structure
US5200031A (en) * 1991-08-26 1993-04-06 Applied Materials, Inc. Method for removal of photoresist over metal which also removes or inactivates corrosion-forming materials remaining from one or more previous metal etch steps
KR100336916B1 (ko) * 1994-02-03 2002-12-02 어플라이드 머티어리얼스, 인코포레이티드 반도체기판의스트립핑,패시베이션및부식반응억제방법
KR100268640B1 (ko) * 1996-01-22 2000-10-16 모리시타 요이찌 알루미늄합금막의 드라이에칭방법과,그 방법에 사용하는 에칭용 가스
US6010603A (en) 1997-07-09 2000-01-04 Applied Materials, Inc. Patterned copper etch for micron and submicron features, using enhanced physical bombardment
US20010049181A1 (en) 1998-11-17 2001-12-06 Sudha Rathi Plasma treatment for cooper oxide reduction
US6355571B1 (en) * 1998-11-17 2002-03-12 Applied Materials, Inc. Method and apparatus for reducing copper oxidation and contamination in a semiconductor device
US6821571B2 (en) 1999-06-18 2004-11-23 Applied Materials Inc. Plasma treatment to enhance adhesion and to minimize oxidation of carbon-containing layers
US6794311B2 (en) 2000-07-14 2004-09-21 Applied Materials Inc. Method and apparatus for treating low k dielectric layers to reduce diffusion
US20040018715A1 (en) * 2002-07-25 2004-01-29 Applied Materials, Inc. Method of cleaning a surface of a material layer
US7229911B2 (en) 2004-04-19 2007-06-12 Applied Materials, Inc. Adhesion improvement for low k dielectrics to conductive materials
JP6262156B2 (ja) * 2012-02-24 2018-01-17 カリフォルニア インスティチュート オブ テクノロジー グラフェン形成のための方法およびシステム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1499857A (en) * 1975-09-18 1978-02-01 Standard Telephones Cables Ltd Glow discharge etching
IT1203089B (it) * 1976-03-03 1989-02-15 Int Plasma Corp Procedimento ed apparecchiatura per eseguire reazioni chimiche nella regione della scarica luminescente di un plasma
US4030967A (en) * 1976-08-16 1977-06-21 Northern Telecom Limited Gaseous plasma etching of aluminum and aluminum oxide
JPS54158343A (en) * 1978-06-05 1979-12-14 Hitachi Ltd Dry etching method for al and al alloy

Also Published As

Publication number Publication date
EP0019915B1 (en) 1984-09-19
DE3069207D1 (en) 1984-10-25
EP0019915A1 (en) 1980-12-10
JPS55158275A (en) 1980-12-09
US4308089A (en) 1981-12-29

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