JPS56167395A - Method of mounting part on circuit board - Google Patents
Method of mounting part on circuit boardInfo
- Publication number
- JPS56167395A JPS56167395A JP7193180A JP7193180A JPS56167395A JP S56167395 A JPS56167395 A JP S56167395A JP 7193180 A JP7193180 A JP 7193180A JP 7193180 A JP7193180 A JP 7193180A JP S56167395 A JPS56167395 A JP S56167395A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- mounting part
- mounting
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7193180A JPS56167395A (en) | 1980-05-27 | 1980-05-27 | Method of mounting part on circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7193180A JPS56167395A (en) | 1980-05-27 | 1980-05-27 | Method of mounting part on circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56167395A true JPS56167395A (en) | 1981-12-23 |
JPS6236640B2 JPS6236640B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-08-07 |
Family
ID=13474749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7193180A Granted JPS56167395A (en) | 1980-05-27 | 1980-05-27 | Method of mounting part on circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56167395A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5750496A (en) * | 1980-09-12 | 1982-03-24 | Hitachi Ltd | Method of reflowing soldering paste |
JPS60226145A (ja) * | 1984-04-25 | 1985-11-11 | Hitachi Ltd | 半導体装置の実装方法 |
JPS61172394A (ja) * | 1985-01-28 | 1986-08-04 | 株式会社日立製作所 | はんだ付け方法 |
JPS6376396A (ja) * | 1986-09-15 | 1988-04-06 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | 回路素子の装着方法 |
JPS63289991A (ja) * | 1987-05-22 | 1988-11-28 | Uchihashi Estec Co Ltd | チップ型電子部品の固着方法 |
JPH01225195A (ja) * | 1988-03-04 | 1989-09-08 | Senju Metal Ind Co Ltd | プリント基板のリフロー方法 |
JPH0697644A (ja) * | 1992-09-14 | 1994-04-08 | Melco:Kk | クリームはんだ溶着用リフロー炉およびクリームはんだを利用したはんだ溶着方法 |
KR20190027535A (ko) * | 2017-09-07 | 2019-03-15 | 한국철도기술연구원 | 회전방향 자유도를 갖는 철도차량용 시소타입 제동패드 |
-
1980
- 1980-05-27 JP JP7193180A patent/JPS56167395A/ja active Granted
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5750496A (en) * | 1980-09-12 | 1982-03-24 | Hitachi Ltd | Method of reflowing soldering paste |
JPS60226145A (ja) * | 1984-04-25 | 1985-11-11 | Hitachi Ltd | 半導体装置の実装方法 |
JPS61172394A (ja) * | 1985-01-28 | 1986-08-04 | 株式会社日立製作所 | はんだ付け方法 |
JPS6376396A (ja) * | 1986-09-15 | 1988-04-06 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | 回路素子の装着方法 |
JPS63289991A (ja) * | 1987-05-22 | 1988-11-28 | Uchihashi Estec Co Ltd | チップ型電子部品の固着方法 |
JPH01225195A (ja) * | 1988-03-04 | 1989-09-08 | Senju Metal Ind Co Ltd | プリント基板のリフロー方法 |
JPH0697644A (ja) * | 1992-09-14 | 1994-04-08 | Melco:Kk | クリームはんだ溶着用リフロー炉およびクリームはんだを利用したはんだ溶着方法 |
KR20190027535A (ko) * | 2017-09-07 | 2019-03-15 | 한국철도기술연구원 | 회전방향 자유도를 갖는 철도차량용 시소타입 제동패드 |
Also Published As
Publication number | Publication date |
---|---|
JPS6236640B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-08-07 |
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