JPS56164538A - Assembling device for semicondutor element - Google Patents

Assembling device for semicondutor element

Info

Publication number
JPS56164538A
JPS56164538A JP6756380A JP6756380A JPS56164538A JP S56164538 A JPS56164538 A JP S56164538A JP 6756380 A JP6756380 A JP 6756380A JP 6756380 A JP6756380 A JP 6756380A JP S56164538 A JPS56164538 A JP S56164538A
Authority
JP
Japan
Prior art keywords
frame
die bonding
bonding
truck
mechanisms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6756380A
Other languages
Japanese (ja)
Inventor
Yuichi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP6756380A priority Critical patent/JPS56164538A/en
Publication of JPS56164538A publication Critical patent/JPS56164538A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To shorten the time required for assembly by arranging a die bonding mechanism composing a full automatic IC assembling system and a plurality of wire bonding mechanisms following the die bonding mechanism in a beeline wherein rails are provided among them and a lead frame completed each process is transferred by using trucks. CONSTITUTION:A lead frame 13 and a belt conveyor 16 loading the frame 13 on a truck 15 are provided in a loading station E composing a die bonding mechanism 1 and die bonding work is performed to the frame 13 in the mechanism 1. And plurally divided wire bonding mechanisms 2-6 are provided behind the die bonding mechanism 1 by positioning in the beeline because complicated processes are involved. The truck 15 is run on the first rail 11 and the frame 13 is stopped at the station B of each mechanism 2-6 and the frame 13 is pushed down to a fixed position of each mechanism 2-6 by conveyors 17 for bonding. At that time, a separate truck 15 is prepared and the frame 13 is passed the stations C of the mechanisms 2-6 by running the frame 13 on the second rail 12 and bonding is performed by moving the trucks 15 together. The frame 13 is transferred to a loading station D to prepare for the next process.
JP6756380A 1980-05-21 1980-05-21 Assembling device for semicondutor element Pending JPS56164538A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6756380A JPS56164538A (en) 1980-05-21 1980-05-21 Assembling device for semicondutor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6756380A JPS56164538A (en) 1980-05-21 1980-05-21 Assembling device for semicondutor element

Publications (1)

Publication Number Publication Date
JPS56164538A true JPS56164538A (en) 1981-12-17

Family

ID=13348546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6756380A Pending JPS56164538A (en) 1980-05-21 1980-05-21 Assembling device for semicondutor element

Country Status (1)

Country Link
JP (1) JPS56164538A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57133639A (en) * 1981-02-12 1982-08-18 Toshiba Corp Manufacture of semiconductor device
KR20000015578A (en) * 1998-08-31 2000-03-15 김규현 Method of wire bonding for semiconductor package fabrication

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57133639A (en) * 1981-02-12 1982-08-18 Toshiba Corp Manufacture of semiconductor device
KR20000015578A (en) * 1998-08-31 2000-03-15 김규현 Method of wire bonding for semiconductor package fabrication

Similar Documents

Publication Publication Date Title
US4718533A (en) Transport installation for a production line having parallel-arranged processing stations
CA1215222A (en) Automatic system for assembly and welding of motor vehicle bodies
US4646915A (en) Workpiece conveying apparatus
ES8607867A1 (en) Device for spacing bottles.
GB1381807A (en) Can-end feeding apparatus
ATE20094T1 (en) TRANSPORT SYSTEM FOR SPINNING PREPARATION.
EP0135360A3 (en) Packaging apparatus
JPS56164538A (en) Assembling device for semicondutor element
GB1127280A (en) Work transfer mechanism for machine tools
ZA814273B (en) Apparatus for reducing tape tension variations in a peripherial belt drive tape transport system
GB1370594A (en) Conveyors
JPS56164539A (en) Assembling device for semiconductor element
CN214398761U (en) Loading equipment's carrier band feeding mechanism
FR2448944A1 (en) Automatic sorter for parcels - has stations along conveyor length with double width belt moving transversely to transfer parcels
GB1286453A (en) Improved conveyor arrangement
JP2534052B2 (en) Work transfer device
GB1504581A (en) Apparatus for intermittently moving sheet material along a sheet feed path
GB1384425A (en)
JPS58167038A (en) Carrying device between presses
FR2399372A1 (en) Automatic machine for de-palletising containers - has feeding station, packets removal station and discharge station at which packets are separated
JPS6111736B2 (en)
JPS57175616A (en) Method to set proper interval between loads on conveyor
JPS56164540A (en) Lead frame carrier in assembling device for semicondutor element
GB1421949A (en) Palletized conveyor machine
GB1523378A (en) Machine timing system