JPS56160608A - Method of measuring surface area of object to be plated - Google Patents
Method of measuring surface area of object to be platedInfo
- Publication number
- JPS56160608A JPS56160608A JP6439380A JP6439380A JPS56160608A JP S56160608 A JPS56160608 A JP S56160608A JP 6439380 A JP6439380 A JP 6439380A JP 6439380 A JP6439380 A JP 6439380A JP S56160608 A JPS56160608 A JP S56160608A
- Authority
- JP
- Japan
- Prior art keywords
- plated
- area
- current value
- electrolytic solution
- value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To make it possible to readily and reliably measure the area of an object to be plated which has a complicated shape, by submerging said object in an electrolytic solution, and measuring the value of the current flowing then.
CONSTITUTION: First, metal test pieces, whose areas are alreadly known and different from each other, are submerged in an electrolytic solution. A given voltage is applied thereto, and the current value at that time is measured in order to obtain the relationship between the current value and the test piece area. Then, to measure the area of an object to be plated, the same electrolytic solution and conditions as used in the current value measurement of the test pieces whose areas were already known are used, and the same voltage is applied to the object to be plated to measure the value of the current flowing at that time. Then, the measured current value is applied to a graph or expression of relation representing the relationship between the previously measured current value and the area. Thereby, the area of the object to be plated is obtained.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6439380A JPS56160608A (en) | 1980-05-15 | 1980-05-15 | Method of measuring surface area of object to be plated |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6439380A JPS56160608A (en) | 1980-05-15 | 1980-05-15 | Method of measuring surface area of object to be plated |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56160608A true JPS56160608A (en) | 1981-12-10 |
Family
ID=13257023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6439380A Pending JPS56160608A (en) | 1980-05-15 | 1980-05-15 | Method of measuring surface area of object to be plated |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56160608A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2542443A1 (en) * | 1983-03-11 | 1984-09-14 | Puippe Jean Claude | METHOD FOR DETERMINING WITH PRECISION THE SURFACE AREA OF AN ELECTRICALLY CONDUCTIVE CONFORMING BODY |
JPS6150001A (en) * | 1984-08-20 | 1986-03-12 | Aizaburo Yagishita | Measuring method of surface area of body |
EP1464734A3 (en) * | 2003-03-21 | 2008-12-03 | Degudent Gmbh | Apparatus and method for manufacturing moulded parts |
US8607608B2 (en) | 2007-02-20 | 2013-12-17 | Seiko Works Ltd. | Bending apparatus and bending method |
-
1980
- 1980-05-15 JP JP6439380A patent/JPS56160608A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2542443A1 (en) * | 1983-03-11 | 1984-09-14 | Puippe Jean Claude | METHOD FOR DETERMINING WITH PRECISION THE SURFACE AREA OF AN ELECTRICALLY CONDUCTIVE CONFORMING BODY |
JPS6150001A (en) * | 1984-08-20 | 1986-03-12 | Aizaburo Yagishita | Measuring method of surface area of body |
EP1464734A3 (en) * | 2003-03-21 | 2008-12-03 | Degudent Gmbh | Apparatus and method for manufacturing moulded parts |
US8607608B2 (en) | 2007-02-20 | 2013-12-17 | Seiko Works Ltd. | Bending apparatus and bending method |
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