JPS561551A - Multilead frame and method of mounting the same - Google Patents

Multilead frame and method of mounting the same

Info

Publication number
JPS561551A
JPS561551A JP7710679A JP7710679A JPS561551A JP S561551 A JPS561551 A JP S561551A JP 7710679 A JP7710679 A JP 7710679A JP 7710679 A JP7710679 A JP 7710679A JP S561551 A JPS561551 A JP S561551A
Authority
JP
Japan
Prior art keywords
leads
lugs
substrate
mounting
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7710679A
Other languages
Japanese (ja)
Inventor
Shigeaki Kubota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MITSUI HAITETSUKU KK
Mitsui Manufacturing Co Ltd
Original Assignee
MITSUI HAITETSUKU KK
Mitsui Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MITSUI HAITETSUKU KK, Mitsui Manufacturing Co Ltd filed Critical MITSUI HAITETSUKU KK
Priority to JP7710679A priority Critical patent/JPS561551A/en
Publication of JPS561551A publication Critical patent/JPS561551A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To bond leads onto a substrate while retaining the flatness of the ends of the leads and uniform interval of the leads by retaining the ends of the leads to be bonded with removable lugs. CONSTITUTION:Leads 2b-5b are bent in reverse direction to lugs 2a-5a. A frame 1 is placed on a ceramic plate 7, and adhered thereto with adhesive glass 8. When the substrate 7 is then passed between rollers 9 and 7, the lugs 2a-5a make contact with the roller 9 to be thus returned downwardly. Since notches 2d-5d are cut between the lugs and the leads, the lugs 2a-5a are cut and isolated and removed from the simple substrate 7 to complete the mounting of the leads 2b-5b onto the substrate 7. The ends of the leads are flat, and the interval among the leads is retained uniformly.
JP7710679A 1979-06-18 1979-06-18 Multilead frame and method of mounting the same Pending JPS561551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7710679A JPS561551A (en) 1979-06-18 1979-06-18 Multilead frame and method of mounting the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7710679A JPS561551A (en) 1979-06-18 1979-06-18 Multilead frame and method of mounting the same

Publications (1)

Publication Number Publication Date
JPS561551A true JPS561551A (en) 1981-01-09

Family

ID=13624519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7710679A Pending JPS561551A (en) 1979-06-18 1979-06-18 Multilead frame and method of mounting the same

Country Status (1)

Country Link
JP (1) JPS561551A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57170556A (en) * 1981-03-27 1982-10-20 Amp Inc Ceramic chip carrier with removable lead frame support

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57170556A (en) * 1981-03-27 1982-10-20 Amp Inc Ceramic chip carrier with removable lead frame support

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