JPS56134404A - Conductive material and method of prdoducing same - Google Patents
Conductive material and method of prdoducing sameInfo
- Publication number
- JPS56134404A JPS56134404A JP3715280A JP3715280A JPS56134404A JP S56134404 A JPS56134404 A JP S56134404A JP 3715280 A JP3715280 A JP 3715280A JP 3715280 A JP3715280 A JP 3715280A JP S56134404 A JPS56134404 A JP S56134404A
- Authority
- JP
- Japan
- Prior art keywords
- prdoducing
- same
- conductive material
- conductive
- prdoducing same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0215—Metallic fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Conductive Materials (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3715280A JPS56134404A (en) | 1980-03-24 | 1980-03-24 | Conductive material and method of prdoducing same |
CA000373400A CA1143933A (en) | 1980-03-24 | 1981-03-19 | Conductive paste |
DE19813111396 DE3111396A1 (de) | 1980-03-24 | 1981-03-23 | Leitende paste |
GB8108999A GB2074604B (en) | 1980-03-24 | 1981-03-23 | Conductive pastes and materials |
NL8101467A NL8101467A (nl) | 1980-03-24 | 1981-03-24 | Geleidende pasta. |
FR8105892A FR2478863A1 (fr) | 1980-03-24 | 1981-03-24 | Pate conductrice d'electricite et procede de fabrication |
US06/452,611 US4435611A (en) | 1980-03-24 | 1982-12-23 | Conductive paste |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3715280A JPS56134404A (en) | 1980-03-24 | 1980-03-24 | Conductive material and method of prdoducing same |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56134404A true JPS56134404A (en) | 1981-10-21 |
Family
ID=12489629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3715280A Pending JPS56134404A (en) | 1980-03-24 | 1980-03-24 | Conductive material and method of prdoducing same |
Country Status (7)
Country | Link |
---|---|
US (1) | US4435611A (ja) |
JP (1) | JPS56134404A (ja) |
CA (1) | CA1143933A (ja) |
DE (1) | DE3111396A1 (ja) |
FR (1) | FR2478863A1 (ja) |
GB (1) | GB2074604B (ja) |
NL (1) | NL8101467A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009153851A (ja) * | 2007-12-27 | 2009-07-16 | Konica Minolta Medical & Graphic Inc | 超音波診断装置およびそれに用いる配線の製造方法 |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57107501A (en) * | 1980-12-25 | 1982-07-05 | Sony Corp | Conduction material |
US4942076A (en) * | 1988-11-03 | 1990-07-17 | Micro Substrates, Inc. | Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same |
US5053195A (en) * | 1989-07-19 | 1991-10-01 | Microelectronics And Computer Technology Corp. | Bonding amalgam and method of making |
US5056706A (en) * | 1989-11-20 | 1991-10-15 | Microelectronics And Computer Technology Corporation | Liquid metal paste for thermal and electrical connections |
DE69031039T2 (de) * | 1990-04-16 | 1997-11-06 | Denki Kagaku Kogyo Kk | Keramische leiterplatte |
US5270491A (en) * | 1990-10-09 | 1993-12-14 | Eastman Kodak Company | Hermetically sealed microelectronic package |
US5149935A (en) * | 1990-10-09 | 1992-09-22 | Eastman Kodak Company | Method and apparatus for forming amalgam preform |
US5061442A (en) * | 1990-10-09 | 1991-10-29 | Eastman Kodak Company | Method of forming a thin sheet of an amalgam |
US5192835A (en) * | 1990-10-09 | 1993-03-09 | Eastman Kodak Company | Bonding of solid state device to terminal board |
US5170930A (en) * | 1991-11-14 | 1992-12-15 | Microelectronics And Computer Technology Corporation | Liquid metal paste for thermal and electrical connections |
JPH05243735A (ja) * | 1992-03-03 | 1993-09-21 | Hitachi Chem Co Ltd | 多層配線板の製造法 |
US5328087A (en) * | 1993-03-29 | 1994-07-12 | Microelectronics And Computer Technology Corporation | Thermally and electrically conductive adhesive material and method of bonding with same |
US5445308A (en) * | 1993-03-29 | 1995-08-29 | Nelson; Richard D. | Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal |
US5808874A (en) * | 1996-05-02 | 1998-09-15 | Tessera, Inc. | Microelectronic connections with liquid conductive elements |
US6027575A (en) * | 1997-10-27 | 2000-02-22 | Ford Motor Company | Metallic adhesive for forming electronic interconnects at low temperatures |
US6598291B2 (en) | 1998-03-20 | 2003-07-29 | Viasystems, Inc. | Via connector and method of making same |
US6303881B1 (en) * | 1998-03-20 | 2001-10-16 | Viasystems, Inc. | Via connector and method of making same |
US6207259B1 (en) * | 1998-11-02 | 2001-03-27 | Kyocera Corporation | Wiring board |
US6347175B1 (en) | 1999-07-14 | 2002-02-12 | Corning Incorporated | Solderable thin film |
JP3473601B2 (ja) * | 2000-12-26 | 2003-12-08 | 株式会社デンソー | プリント基板およびその製造方法 |
US7377032B2 (en) * | 2003-11-21 | 2008-05-27 | Mitsui Mining & Smelting Co., Ltd. | Process for producing a printed wiring board for mounting electronic components |
JP4803478B2 (ja) * | 2004-10-20 | 2011-10-26 | 大日本印刷株式会社 | Ga系合金及びこれを用いた有機機能素子 |
KR100870362B1 (ko) * | 2007-03-15 | 2008-11-25 | 삼성에스디아이 주식회사 | 이차전지용 보호회로 기판과 이를 이용한 이차전지 |
CN101417375B (zh) * | 2007-10-23 | 2010-12-29 | 北京有色金属研究总院 | 一种电子元件焊接用的无铅焊料合金 |
EP2082825B1 (en) * | 2008-01-18 | 2014-07-30 | Napra Co., Ltd. | Wiring board having a hole with a metal wiring formed therein, and method for producing the same |
CN102019515B (zh) * | 2011-01-21 | 2012-08-22 | 湘潭电机股份有限公司 | 一种低电阻率锡钎焊料和配套焊膏及其应用 |
WO2015117125A1 (en) * | 2014-02-03 | 2015-08-06 | North Carolina State University | Three-dimensional printing of metallic materials |
JP2018064063A (ja) * | 2016-10-14 | 2018-04-19 | イリソ電子工業株式会社 | 回路基板及び回路装置 |
CN117597744A (zh) * | 2021-02-26 | 2024-02-23 | 液态电线公司 | 用于制造和使用高度可持续电路的装置、系统及方法 |
CN113293303A (zh) * | 2021-06-04 | 2021-08-24 | 江西理工大学 | 一种协同还原熔炼废铅膏生产铅合金的方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3141238A (en) | 1960-11-22 | 1964-07-21 | Jr George G Harman | Method of low temperature bonding for subsequent high temperature use |
US3157539A (en) | 1961-09-28 | 1964-11-17 | Dreher Manfrid | Method of producing shaped metallic bodies having a copper alloy base and a noble metal outer coating |
US3196007A (en) | 1962-06-12 | 1965-07-20 | Brush Beryllium Co | Beryllium copper composition and method of producing green compacts and sintered articles therefrom |
SU236215A1 (ru) | 1967-02-13 | 1969-01-24 | Пастообразный припой для пайки деталей электровакуумных приборов | |
US3601523A (en) | 1970-06-19 | 1971-08-24 | Buckbee Mears Co | Through hole connectors |
US4015981A (en) | 1976-03-30 | 1977-04-05 | Svetlana Tanovna Rogova | Tooth filling alloy |
JPS52126793A (en) * | 1976-04-15 | 1977-10-24 | Matsushita Electric Works Ltd | Flexible conductor |
US4383363A (en) | 1977-09-01 | 1983-05-17 | Sharp Kabushiki Kaisha | Method of making a through-hole connector |
US4233103A (en) | 1978-12-20 | 1980-11-11 | The United States Of America As Represented By The Secretary Of The Air Force | High temperature-resistant conductive adhesive and method employing same |
JPS55108103A (en) * | 1979-02-14 | 1980-08-19 | Sony Corp | Conductive materaial |
-
1980
- 1980-03-24 JP JP3715280A patent/JPS56134404A/ja active Pending
-
1981
- 1981-03-19 CA CA000373400A patent/CA1143933A/en not_active Expired
- 1981-03-23 GB GB8108999A patent/GB2074604B/en not_active Expired
- 1981-03-23 DE DE19813111396 patent/DE3111396A1/de not_active Withdrawn
- 1981-03-24 NL NL8101467A patent/NL8101467A/nl not_active Application Discontinuation
- 1981-03-24 FR FR8105892A patent/FR2478863A1/fr active Granted
-
1982
- 1982-12-23 US US06/452,611 patent/US4435611A/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009153851A (ja) * | 2007-12-27 | 2009-07-16 | Konica Minolta Medical & Graphic Inc | 超音波診断装置およびそれに用いる配線の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
GB2074604A (en) | 1981-11-04 |
FR2478863A1 (fr) | 1981-09-25 |
FR2478863B1 (ja) | 1985-05-03 |
CA1143933A (en) | 1983-04-05 |
DE3111396A1 (de) | 1982-04-29 |
US4435611A (en) | 1984-03-06 |
NL8101467A (nl) | 1981-10-16 |
GB2074604B (en) | 1984-02-08 |
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