JPS5613040A - Method and apparatus for washing of ion exchange resin - Google Patents

Method and apparatus for washing of ion exchange resin

Info

Publication number
JPS5613040A
JPS5613040A JP8732179A JP8732179A JPS5613040A JP S5613040 A JPS5613040 A JP S5613040A JP 8732179 A JP8732179 A JP 8732179A JP 8732179 A JP8732179 A JP 8732179A JP S5613040 A JPS5613040 A JP S5613040A
Authority
JP
Japan
Prior art keywords
water
tower
resins
pipe
drain pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8732179A
Other languages
Japanese (ja)
Other versions
JPS595015B2 (en
Inventor
Masahiro Hagiwara
Takao Ino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP54087321A priority Critical patent/JPS595015B2/en
Publication of JPS5613040A publication Critical patent/JPS5613040A/en
Publication of JPS595015B2 publication Critical patent/JPS595015B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Treatment Of Water By Ion Exchange (AREA)

Abstract

PURPOSE: To effectively wash the resins while decreasing the amount of the waste liquid after the treatment by supplying ion exchange resins together with water flow into regenerating towers which have beforehand been supplied with water up to near the free board drain pipe and discharging the clad-contg. waste liquid from the drain pipe.
CONSTITUTION: The contaminated ion exchange resins are admitted together with water flow through a pipe 4 into the 1st regenerating tower 1 which has beforehand been supplied with water up to slightly above a free board drain pipe 2 to be formed with the water layer shown by a water level 15 and the waste liquid containing clad portions is discharged from a drain pipe 2. Thence, when the amount of the resins sedimented on the tower bottom reaches the level of about 30W 35cm below the drain pipe 2, the supplying of the resins is suspended. Air is then press-fed from a pipe 8 into the tower 1 to perform scrubbing, thereby allowing the clad portions deposited on the resins to desorb into the water. Thence, a resin discharge pipe 5 and a lead-in pipe 4' are communicated and the clad-portion-contg. waste liquid and the resins in the 1st regenerating tower 1 are transferred into the 2nd regenerating tower 1' which has beforehand been supplied with water in the same manner as for the tower 1. The same operations having been made in the tower 1 are then continued.
COPYRIGHT: (C)1981,JPO&Japio
JP54087321A 1979-07-10 1979-07-10 How to clean ion exchange resin Expired JPS595015B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54087321A JPS595015B2 (en) 1979-07-10 1979-07-10 How to clean ion exchange resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54087321A JPS595015B2 (en) 1979-07-10 1979-07-10 How to clean ion exchange resin

Publications (2)

Publication Number Publication Date
JPS5613040A true JPS5613040A (en) 1981-02-07
JPS595015B2 JPS595015B2 (en) 1984-02-02

Family

ID=13911577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54087321A Expired JPS595015B2 (en) 1979-07-10 1979-07-10 How to clean ion exchange resin

Country Status (1)

Country Link
JP (1) JPS595015B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62177085A (en) * 1986-01-29 1987-08-03 Nitto Electric Ind Co Ltd Adhesive tape for connecting electronic part
EP2033996A1 (en) 2007-09-06 2009-03-11 Nitto Denko Corporation Pressure-sensitive adhesive sheet for dicing and dicing method
WO2009066435A1 (en) 2007-11-19 2009-05-28 Nitto Denko Corporation Resin laminate, pressure sensitive adhesive sheet, method for working adherend using the pressure sensitive adhesive sheet, and device for separating the pressure sensitive adhesive sheet
WO2012099122A1 (en) 2011-01-19 2012-07-26 日東電工株式会社 Double-sided adhesive tape or sheet, and adherend processing method
WO2012099121A1 (en) 2011-01-19 2012-07-26 日東電工株式会社 Double-sided adhesive tape or sheet, and adherend processing method
WO2012118152A1 (en) 2011-03-03 2012-09-07 日東電工株式会社 Heat-peelable adhesive sheet
WO2013011850A1 (en) 2011-07-15 2013-01-24 日東電工株式会社 Method for manufacturing electronic component and adhesive sheet used in method for manufacturing electronic component
EP2644669A1 (en) 2012-03-27 2013-10-02 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0516644Y2 (en) * 1986-03-27 1993-05-06

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62177085A (en) * 1986-01-29 1987-08-03 Nitto Electric Ind Co Ltd Adhesive tape for connecting electronic part
EP2033996A1 (en) 2007-09-06 2009-03-11 Nitto Denko Corporation Pressure-sensitive adhesive sheet for dicing and dicing method
WO2009066435A1 (en) 2007-11-19 2009-05-28 Nitto Denko Corporation Resin laminate, pressure sensitive adhesive sheet, method for working adherend using the pressure sensitive adhesive sheet, and device for separating the pressure sensitive adhesive sheet
WO2012099122A1 (en) 2011-01-19 2012-07-26 日東電工株式会社 Double-sided adhesive tape or sheet, and adherend processing method
WO2012099121A1 (en) 2011-01-19 2012-07-26 日東電工株式会社 Double-sided adhesive tape or sheet, and adherend processing method
WO2012118152A1 (en) 2011-03-03 2012-09-07 日東電工株式会社 Heat-peelable adhesive sheet
WO2013011850A1 (en) 2011-07-15 2013-01-24 日東電工株式会社 Method for manufacturing electronic component and adhesive sheet used in method for manufacturing electronic component
EP2644669A1 (en) 2012-03-27 2013-10-02 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet

Also Published As

Publication number Publication date
JPS595015B2 (en) 1984-02-02

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