JPS56128691A - Laser working method - Google Patents

Laser working method

Info

Publication number
JPS56128691A
JPS56128691A JP3180880A JP3180880A JPS56128691A JP S56128691 A JPS56128691 A JP S56128691A JP 3180880 A JP3180880 A JP 3180880A JP 3180880 A JP3180880 A JP 3180880A JP S56128691 A JPS56128691 A JP S56128691A
Authority
JP
Japan
Prior art keywords
worked
laser beam
real image
laser
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3180880A
Other languages
Japanese (ja)
Other versions
JPS6043236B2 (en
Inventor
Taketoshi Yonezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP55031808A priority Critical patent/JPS6043236B2/en
Publication of JPS56128691A publication Critical patent/JPS56128691A/en
Publication of JPS6043236B2 publication Critical patent/JPS6043236B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To perform a perforating work and so on precisely according to the standard, by arranging a reference material above the material to be worked to focus a real image by an optical system and by moving the material to be worked so that this focused image and the center of a laser beam coincide with each other. CONSTITUTION:Material 1 to be worked consisting of cylinder 1a, plane plate 1b having hole 1d, and plane plate 1c to be worked is put on stage 2. The light emitted from illuminating light source 6 is turned by semipermeable mirror 7 and reaches material 1, and the reflection light is condensed by lens 8 and real image 9a of hole 1d is focused onto glass plate 9. Reference mark 9b to obtain the center of the laser beam is described on glass plate 9. This reference mark 9b and real image 9a are picked up by ITV camera 13 and are observed on the television screen, and stage 2 is so moved that images 9a and 9b coincide with each other. After this adjustment, the laser beam is irradiated by laser oscillator 3 to perform the high-precision laser work with good reproducibility.
JP55031808A 1980-03-12 1980-03-12 Laser processing method Expired JPS6043236B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55031808A JPS6043236B2 (en) 1980-03-12 1980-03-12 Laser processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55031808A JPS6043236B2 (en) 1980-03-12 1980-03-12 Laser processing method

Publications (2)

Publication Number Publication Date
JPS56128691A true JPS56128691A (en) 1981-10-08
JPS6043236B2 JPS6043236B2 (en) 1985-09-27

Family

ID=12341385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55031808A Expired JPS6043236B2 (en) 1980-03-12 1980-03-12 Laser processing method

Country Status (1)

Country Link
JP (1) JPS6043236B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2213403A1 (en) * 2000-09-13 2010-08-04 Hamamatsu Photonics K.K. Laser processing apparatus with controller for precisely positioning the focus point in the object to be processed
US8865566B2 (en) 2002-12-03 2014-10-21 Hamamatsu Photonics K.K. Method of cutting semiconductor substrate
US8889525B2 (en) 2002-03-12 2014-11-18 Hamamatsu Photonics K.K. Substrate dividing method
PL423312A1 (en) * 2017-10-30 2019-05-06 Sorter Spolka Jawna Konrad Grzeszczyk Michal Ziomek Method for counting objects with circular o ellipse cross-section, preferably the cigarette filters and the system for execution of this method

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2213403A1 (en) * 2000-09-13 2010-08-04 Hamamatsu Photonics K.K. Laser processing apparatus with controller for precisely positioning the focus point in the object to be processed
US10796959B2 (en) 2000-09-13 2020-10-06 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US9837315B2 (en) 2000-09-13 2017-12-05 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US8937264B2 (en) 2000-09-13 2015-01-20 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US8946591B2 (en) 2000-09-13 2015-02-03 Hamamatsu Photonics K.K. Method of manufacturing a semiconductor device formed using a substrate cutting method
US8946592B2 (en) 2000-09-13 2015-02-03 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US9543207B2 (en) 2002-03-12 2017-01-10 Hamamatsu Photonics K.K. Substrate dividing method
US9287177B2 (en) 2002-03-12 2016-03-15 Hamamatsu Photonics K.K. Substrate dividing method
US9142458B2 (en) 2002-03-12 2015-09-22 Hamamatsu Photonics K.K. Substrate dividing method
US9543256B2 (en) 2002-03-12 2017-01-10 Hamamatsu Photonics K.K. Substrate dividing method
US9548246B2 (en) 2002-03-12 2017-01-17 Hamamatsu Photonics K.K. Substrate dividing method
US9553023B2 (en) 2002-03-12 2017-01-24 Hamamatsu Photonics K.K. Substrate dividing method
US9711405B2 (en) 2002-03-12 2017-07-18 Hamamatsu Photonics K.K. Substrate dividing method
US8889525B2 (en) 2002-03-12 2014-11-18 Hamamatsu Photonics K.K. Substrate dividing method
US10068801B2 (en) 2002-03-12 2018-09-04 Hamamatsu Photonics K.K. Substrate dividing method
US10622255B2 (en) 2002-03-12 2020-04-14 Hamamatsu Photonics K.K. Substrate dividing method
US11424162B2 (en) 2002-03-12 2022-08-23 Hamamatsu Photonics K.K. Substrate dividing method
US8865566B2 (en) 2002-12-03 2014-10-21 Hamamatsu Photonics K.K. Method of cutting semiconductor substrate
PL423312A1 (en) * 2017-10-30 2019-05-06 Sorter Spolka Jawna Konrad Grzeszczyk Michal Ziomek Method for counting objects with circular o ellipse cross-section, preferably the cigarette filters and the system for execution of this method

Also Published As

Publication number Publication date
JPS6043236B2 (en) 1985-09-27

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