JPS56128691A - Laser working method - Google Patents
Laser working methodInfo
- Publication number
- JPS56128691A JPS56128691A JP3180880A JP3180880A JPS56128691A JP S56128691 A JPS56128691 A JP S56128691A JP 3180880 A JP3180880 A JP 3180880A JP 3180880 A JP3180880 A JP 3180880A JP S56128691 A JPS56128691 A JP S56128691A
- Authority
- JP
- Japan
- Prior art keywords
- worked
- laser beam
- real image
- laser
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laser Beam Processing (AREA)
Abstract
PURPOSE:To perform a perforating work and so on precisely according to the standard, by arranging a reference material above the material to be worked to focus a real image by an optical system and by moving the material to be worked so that this focused image and the center of a laser beam coincide with each other. CONSTITUTION:Material 1 to be worked consisting of cylinder 1a, plane plate 1b having hole 1d, and plane plate 1c to be worked is put on stage 2. The light emitted from illuminating light source 6 is turned by semipermeable mirror 7 and reaches material 1, and the reflection light is condensed by lens 8 and real image 9a of hole 1d is focused onto glass plate 9. Reference mark 9b to obtain the center of the laser beam is described on glass plate 9. This reference mark 9b and real image 9a are picked up by ITV camera 13 and are observed on the television screen, and stage 2 is so moved that images 9a and 9b coincide with each other. After this adjustment, the laser beam is irradiated by laser oscillator 3 to perform the high-precision laser work with good reproducibility.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55031808A JPS6043236B2 (en) | 1980-03-12 | 1980-03-12 | Laser processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55031808A JPS6043236B2 (en) | 1980-03-12 | 1980-03-12 | Laser processing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56128691A true JPS56128691A (en) | 1981-10-08 |
JPS6043236B2 JPS6043236B2 (en) | 1985-09-27 |
Family
ID=12341385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55031808A Expired JPS6043236B2 (en) | 1980-03-12 | 1980-03-12 | Laser processing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6043236B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2213403A1 (en) * | 2000-09-13 | 2010-08-04 | Hamamatsu Photonics K.K. | Laser processing apparatus with controller for precisely positioning the focus point in the object to be processed |
US8865566B2 (en) | 2002-12-03 | 2014-10-21 | Hamamatsu Photonics K.K. | Method of cutting semiconductor substrate |
US8889525B2 (en) | 2002-03-12 | 2014-11-18 | Hamamatsu Photonics K.K. | Substrate dividing method |
PL423312A1 (en) * | 2017-10-30 | 2019-05-06 | Sorter Spolka Jawna Konrad Grzeszczyk Michal Ziomek | Method for counting objects with circular o ellipse cross-section, preferably the cigarette filters and the system for execution of this method |
-
1980
- 1980-03-12 JP JP55031808A patent/JPS6043236B2/en not_active Expired
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2213403A1 (en) * | 2000-09-13 | 2010-08-04 | Hamamatsu Photonics K.K. | Laser processing apparatus with controller for precisely positioning the focus point in the object to be processed |
US10796959B2 (en) | 2000-09-13 | 2020-10-06 | Hamamatsu Photonics K.K. | Laser processing method and laser processing apparatus |
US9837315B2 (en) | 2000-09-13 | 2017-12-05 | Hamamatsu Photonics K.K. | Laser processing method and laser processing apparatus |
US8937264B2 (en) | 2000-09-13 | 2015-01-20 | Hamamatsu Photonics K.K. | Laser processing method and laser processing apparatus |
US8946591B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Method of manufacturing a semiconductor device formed using a substrate cutting method |
US8946592B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Laser processing method and laser processing apparatus |
US9543207B2 (en) | 2002-03-12 | 2017-01-10 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9287177B2 (en) | 2002-03-12 | 2016-03-15 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9142458B2 (en) | 2002-03-12 | 2015-09-22 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9543256B2 (en) | 2002-03-12 | 2017-01-10 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9548246B2 (en) | 2002-03-12 | 2017-01-17 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9553023B2 (en) | 2002-03-12 | 2017-01-24 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9711405B2 (en) | 2002-03-12 | 2017-07-18 | Hamamatsu Photonics K.K. | Substrate dividing method |
US8889525B2 (en) | 2002-03-12 | 2014-11-18 | Hamamatsu Photonics K.K. | Substrate dividing method |
US10068801B2 (en) | 2002-03-12 | 2018-09-04 | Hamamatsu Photonics K.K. | Substrate dividing method |
US10622255B2 (en) | 2002-03-12 | 2020-04-14 | Hamamatsu Photonics K.K. | Substrate dividing method |
US11424162B2 (en) | 2002-03-12 | 2022-08-23 | Hamamatsu Photonics K.K. | Substrate dividing method |
US8865566B2 (en) | 2002-12-03 | 2014-10-21 | Hamamatsu Photonics K.K. | Method of cutting semiconductor substrate |
PL423312A1 (en) * | 2017-10-30 | 2019-05-06 | Sorter Spolka Jawna Konrad Grzeszczyk Michal Ziomek | Method for counting objects with circular o ellipse cross-section, preferably the cigarette filters and the system for execution of this method |
Also Published As
Publication number | Publication date |
---|---|
JPS6043236B2 (en) | 1985-09-27 |
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