JPS56123572U - - Google Patents

Info

Publication number
JPS56123572U
JPS56123572U JP1980020723U JP2072380U JPS56123572U JP S56123572 U JPS56123572 U JP S56123572U JP 1980020723 U JP1980020723 U JP 1980020723U JP 2072380 U JP2072380 U JP 2072380U JP S56123572 U JPS56123572 U JP S56123572U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1980020723U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980020723U priority Critical patent/JPS56123572U/ja
Publication of JPS56123572U publication Critical patent/JPS56123572U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
JP1980020723U 1980-02-20 1980-02-20 Pending JPS56123572U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980020723U JPS56123572U (zh) 1980-02-20 1980-02-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980020723U JPS56123572U (zh) 1980-02-20 1980-02-20

Publications (1)

Publication Number Publication Date
JPS56123572U true JPS56123572U (zh) 1981-09-19

Family

ID=29616911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980020723U Pending JPS56123572U (zh) 1980-02-20 1980-02-20

Country Status (1)

Country Link
JP (1) JPS56123572U (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005303211A (ja) * 2004-04-15 2005-10-27 Stanley Electric Co Ltd 平面照射型ｌｅｄ
JP2005317977A (ja) * 2004-04-29 2005-11-10 Lg Phillips Lcd Co Ltd Ｌｅｄランプユニット
JP2010003941A (ja) * 2008-06-23 2010-01-07 Mitsubishi Electric Corp Ｌｅｄ光源、面状光源装置および表示装置
JP2011044756A (ja) * 2005-07-26 2011-03-03 Samsung Led Co Ltd 拡散材料を用いたｌｅｄパッケージ及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5124866B1 (zh) * 1969-03-22 1976-07-27

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5124866B1 (zh) * 1969-03-22 1976-07-27

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005303211A (ja) * 2004-04-15 2005-10-27 Stanley Electric Co Ltd 平面照射型ｌｅｄ
JP4665209B2 (ja) * 2004-04-15 2011-04-06 スタンレー電気株式会社 平面照射型ｌｅｄ
JP2005317977A (ja) * 2004-04-29 2005-11-10 Lg Phillips Lcd Co Ltd Ｌｅｄランプユニット
JP4579761B2 (ja) * 2004-04-29 2010-11-10 エルジー ディスプレイ カンパニー リミテッド Ｌｅｄランプユニット
JP2011044756A (ja) * 2005-07-26 2011-03-03 Samsung Led Co Ltd 拡散材料を用いたｌｅｄパッケージ及びその製造方法
JP2010003941A (ja) * 2008-06-23 2010-01-07 Mitsubishi Electric Corp Ｌｅｄ光源、面状光源装置および表示装置

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