JPS56116635A - Film-carrier - Google Patents

Film-carrier

Info

Publication number
JPS56116635A
JPS56116635A JP1987380A JP1987380A JPS56116635A JP S56116635 A JPS56116635 A JP S56116635A JP 1987380 A JP1987380 A JP 1987380A JP 1987380 A JP1987380 A JP 1987380A JP S56116635 A JPS56116635 A JP S56116635A
Authority
JP
Japan
Prior art keywords
film
density
lead wire
carrier
bonding portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987380A
Other languages
English (en)
Inventor
Hiroshi Uehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP1987380A priority Critical patent/JPS56116635A/ja
Publication of JPS56116635A publication Critical patent/JPS56116635A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861Lead-frames fixed on or encapsulated in insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
JP1987380A 1980-02-20 1980-02-20 Film-carrier Pending JPS56116635A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987380A JPS56116635A (en) 1980-02-20 1980-02-20 Film-carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987380A JPS56116635A (en) 1980-02-20 1980-02-20 Film-carrier

Publications (1)

Publication Number Publication Date
JPS56116635A true JPS56116635A (en) 1981-09-12

Family

ID=12011325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987380A Pending JPS56116635A (en) 1980-02-20 1980-02-20 Film-carrier

Country Status (1)

Country Link
JP (1) JPS56116635A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5726848U (ja) * 1980-07-22 1982-02-12
JPH02165647A (ja) * 1988-10-28 1990-06-26 Internatl Business Mach Corp <Ibm> 集積回路実装構造体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5726848U (ja) * 1980-07-22 1982-02-12
JPH02165647A (ja) * 1988-10-28 1990-06-26 Internatl Business Mach Corp <Ibm> 集積回路実装構造体

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