JPS56111237A - Testing apparatus for semiconductor device - Google Patents

Testing apparatus for semiconductor device

Info

Publication number
JPS56111237A
JPS56111237A JP1362480A JP1362480A JPS56111237A JP S56111237 A JPS56111237 A JP S56111237A JP 1362480 A JP1362480 A JP 1362480A JP 1362480 A JP1362480 A JP 1362480A JP S56111237 A JPS56111237 A JP S56111237A
Authority
JP
Japan
Prior art keywords
prober
contact
semiconductor device
testing apparatus
spherical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1362480A
Other languages
English (en)
Inventor
Sakatoshi Okubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1362480A priority Critical patent/JPS56111237A/ja
Publication of JPS56111237A publication Critical patent/JPS56111237A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
JP1362480A 1980-02-08 1980-02-08 Testing apparatus for semiconductor device Pending JPS56111237A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1362480A JPS56111237A (en) 1980-02-08 1980-02-08 Testing apparatus for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1362480A JPS56111237A (en) 1980-02-08 1980-02-08 Testing apparatus for semiconductor device

Publications (1)

Publication Number Publication Date
JPS56111237A true JPS56111237A (en) 1981-09-02

Family

ID=11838381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1362480A Pending JPS56111237A (en) 1980-02-08 1980-02-08 Testing apparatus for semiconductor device

Country Status (1)

Country Link
JP (1) JPS56111237A (ja)

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