JPS56110659U - - Google Patents
Info
- Publication number
- JPS56110659U JPS56110659U JP19096080U JP19096080U JPS56110659U JP S56110659 U JPS56110659 U JP S56110659U JP 19096080 U JP19096080 U JP 19096080U JP 19096080 U JP19096080 U JP 19096080U JP S56110659 U JPS56110659 U JP S56110659U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/731—Location prior to the connecting process
- H01L2224/73101—Location prior to the connecting process on the same surface
- H01L2224/73103—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19096080U JPS56110659U (ja) | 1980-12-22 | 1980-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19096080U JPS56110659U (ja) | 1980-12-22 | 1980-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56110659U true JPS56110659U (ja) | 1981-08-27 |
Family
ID=29695678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19096080U Pending JPS56110659U (ja) | 1980-12-22 | 1980-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56110659U (ja) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58197793A (ja) * | 1982-05-13 | 1983-11-17 | シャープ株式会社 | 電子部品の取り付け方法 |
| JPS61166534U (ja) * | 1985-04-02 | 1986-10-16 | ||
| JPS63160351A (ja) * | 1986-12-24 | 1988-07-04 | Seikosha Co Ltd | Ｉｃチップの実装方法 |
| JPH01209795A (ja) * | 1988-02-18 | 1989-08-23 | Nissha Printing Co Ltd | 積層回路基板 |
| JP2006332293A (ja) * | 2005-05-25 | 2006-12-07 | Konica Minolta Holdings Inc | 配線基板と電極部品との接合方法及びインクジェットヘッドの製造方法 |
-
1980
- 1980-12-22 JP JP19096080U patent/JPS56110659U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58197793A (ja) * | 1982-05-13 | 1983-11-17 | シャープ株式会社 | 電子部品の取り付け方法 |
| JPS61166534U (ja) * | 1985-04-02 | 1986-10-16 | ||
| JPS63160351A (ja) * | 1986-12-24 | 1988-07-04 | Seikosha Co Ltd | Ｉｃチップの実装方法 |
| JPH01209795A (ja) * | 1988-02-18 | 1989-08-23 | Nissha Printing Co Ltd | 積層回路基板 |
| JP2006332293A (ja) * | 2005-05-25 | 2006-12-07 | Konica Minolta Holdings Inc | 配線基板と電極部品との接合方法及びインクジェットヘッドの製造方法 |