JPS56110248A - Manufacture of filler for semiconductor sealing resin - Google Patents
Manufacture of filler for semiconductor sealing resinInfo
- Publication number
- JPS56110248A JPS56110248A JP1404880A JP1404880A JPS56110248A JP S56110248 A JPS56110248 A JP S56110248A JP 1404880 A JP1404880 A JP 1404880A JP 1404880 A JP1404880 A JP 1404880A JP S56110248 A JPS56110248 A JP S56110248A
- Authority
- JP
- Japan
- Prior art keywords
- filler
- sealing resin
- manufacture
- semiconductor sealing
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1404880A JPS56110248A (en) | 1980-02-06 | 1980-02-06 | Manufacture of filler for semiconductor sealing resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1404880A JPS56110248A (en) | 1980-02-06 | 1980-02-06 | Manufacture of filler for semiconductor sealing resin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56110248A true JPS56110248A (en) | 1981-09-01 |
Family
ID=11850205
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1404880A Pending JPS56110248A (en) | 1980-02-06 | 1980-02-06 | Manufacture of filler for semiconductor sealing resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56110248A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61143466A (ja) * | 1984-12-18 | 1986-07-01 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
JPS61243853A (ja) * | 1985-04-19 | 1986-10-30 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
-
1980
- 1980-02-06 JP JP1404880A patent/JPS56110248A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61143466A (ja) * | 1984-12-18 | 1986-07-01 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
JPH0242383B2 (ja) * | 1984-12-18 | 1990-09-21 | ||
JPS61243853A (ja) * | 1985-04-19 | 1986-10-30 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
JPS6337127B2 (ja) * | 1985-04-19 | 1988-07-22 | Shinetsu Chem Ind Co |
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