JPS56109221A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS56109221A JPS56109221A JP1162380A JP1162380A JPS56109221A JP S56109221 A JPS56109221 A JP S56109221A JP 1162380 A JP1162380 A JP 1162380A JP 1162380 A JP1162380 A JP 1162380A JP S56109221 A JPS56109221 A JP S56109221A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- styrene
- maleic acid
- epoxy
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
Abstract
PURPOSE: An epoxy resin improved with regard to deterioration of working circumstance and of ability of the cured product, which is prepared by compounding a low styrene-maleic acid polymer prepared in a specified manner with an epoxy resin.
CONSTITUTION: A low styrene-maleic acid polymer (A), obtained by the reaction of (i) an α-alkyl-substituted styrene-containing styrene with (ii) a maleic acid, in a mol ratio of (i) to (ii) of 1W5 in the absence of a radical polymerization catalyst under the reflux of an unreactive organic solvent of b.p. ≥130°C, is compounded with an epoxy resin (B) having at least two epoxy groups in one molecule, in such a proportion that at least 0.5 of the acid anhydride group or carboxyl group in said low polymer (A) is contained for every epoxy group in the epoxy resin. The organic solvent of b.p. ≥130°C is preferably an aromatic solvent such as xylene, cumene, cymene or chlorobenzene.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1162380A JPS56109221A (en) | 1980-02-01 | 1980-02-01 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1162380A JPS56109221A (en) | 1980-02-01 | 1980-02-01 | Epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56109221A true JPS56109221A (en) | 1981-08-29 |
Family
ID=11783042
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1162380A Pending JPS56109221A (en) | 1980-02-01 | 1980-02-01 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56109221A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5864259A (en) * | 1981-10-09 | 1983-04-16 | 電気化学工業株式会社 | Thermosettable resin composition and manufacture of metal coated laminate board therewith |
WO2009062927A1 (en) * | 2007-11-13 | 2009-05-22 | Basf Se | Copolymers of para-alpha dimethylstyrene and thermoplastic compositions |
-
1980
- 1980-02-01 JP JP1162380A patent/JPS56109221A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5864259A (en) * | 1981-10-09 | 1983-04-16 | 電気化学工業株式会社 | Thermosettable resin composition and manufacture of metal coated laminate board therewith |
JPH0216766B2 (en) * | 1981-10-09 | 1990-04-18 | Denki Kagaku Kogyo Kk | |
WO2009062927A1 (en) * | 2007-11-13 | 2009-05-22 | Basf Se | Copolymers of para-alpha dimethylstyrene and thermoplastic compositions |
US8022146B2 (en) | 2007-11-13 | 2011-09-20 | Basf Se | Copolymers of para-alpha dimethylstyrene and thermoplastic compositions |
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