JPS56104926A - Epoxy resin composition for sealing electronic parts - Google Patents

Epoxy resin composition for sealing electronic parts

Info

Publication number
JPS56104926A
JPS56104926A JP763580A JP763580A JPS56104926A JP S56104926 A JPS56104926 A JP S56104926A JP 763580 A JP763580 A JP 763580A JP 763580 A JP763580 A JP 763580A JP S56104926 A JPS56104926 A JP S56104926A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
imidazole
electronic parts
sealing electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP763580A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6136772B2 (enExample
Inventor
Yoshihiro Kubota
Kiyohiro Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin-Etsu Chemical Co Ltd
Original Assignee
Shin-Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Chemical Co Ltd filed Critical Shin-Etsu Chemical Co Ltd
Priority to JP763580A priority Critical patent/JPS56104926A/ja
Publication of JPS56104926A publication Critical patent/JPS56104926A/ja
Publication of JPS6136772B2 publication Critical patent/JPS6136772B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Organic Insulating Materials (AREA)
JP763580A 1980-01-25 1980-01-25 Epoxy resin composition for sealing electronic parts Granted JPS56104926A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP763580A JPS56104926A (en) 1980-01-25 1980-01-25 Epoxy resin composition for sealing electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP763580A JPS56104926A (en) 1980-01-25 1980-01-25 Epoxy resin composition for sealing electronic parts

Publications (2)

Publication Number Publication Date
JPS56104926A true JPS56104926A (en) 1981-08-21
JPS6136772B2 JPS6136772B2 (enExample) 1986-08-20

Family

ID=11671280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP763580A Granted JPS56104926A (en) 1980-01-25 1980-01-25 Epoxy resin composition for sealing electronic parts

Country Status (1)

Country Link
JP (1) JPS56104926A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6259660A (ja) * 1985-09-11 1987-03-16 Japan Synthetic Rubber Co Ltd フエノ−ル樹脂組成物
WO2022043421A1 (en) * 2020-08-28 2022-03-03 Basf Coatings Gmbh Solvent-borne, two-pack, anticorrosion coating composition

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6360775U (enExample) * 1986-10-09 1988-04-22

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6259660A (ja) * 1985-09-11 1987-03-16 Japan Synthetic Rubber Co Ltd フエノ−ル樹脂組成物
WO2022043421A1 (en) * 2020-08-28 2022-03-03 Basf Coatings Gmbh Solvent-borne, two-pack, anticorrosion coating composition
CN115989092A (zh) * 2020-08-28 2023-04-18 巴斯夫涂料有限公司 溶剂性双包装防腐涂料组合物

Also Published As

Publication number Publication date
JPS6136772B2 (enExample) 1986-08-20

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