JPS56104926A - Epoxy resin composition for sealing electronic parts - Google Patents
Epoxy resin composition for sealing electronic partsInfo
- Publication number
- JPS56104926A JPS56104926A JP763580A JP763580A JPS56104926A JP S56104926 A JPS56104926 A JP S56104926A JP 763580 A JP763580 A JP 763580A JP 763580 A JP763580 A JP 763580A JP S56104926 A JPS56104926 A JP S56104926A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- imidazole
- electronic parts
- sealing electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 title abstract 4
- 239000000203 mixture Substances 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
- DZBUGLKDJFMEHC-UHFFFAOYSA-N acridine Chemical compound C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 abstract 4
- RGCKGOZRHPZPFP-UHFFFAOYSA-N alizarin Chemical compound C1=CC=C2C(=O)C3=C(O)C(O)=CC=C3C(=O)C2=C1 RGCKGOZRHPZPFP-UHFFFAOYSA-N 0.000 abstract 4
- 239000003054 catalyst Substances 0.000 abstract 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 3
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 abstract 2
- 229940105324 1,2-naphthoquinone Drugs 0.000 abstract 2
- LLPKQRMDOFYSGZ-UHFFFAOYSA-N 2,5-dimethyl-1h-imidazole Chemical compound CC1=CN=C(C)N1 LLPKQRMDOFYSGZ-UHFFFAOYSA-N 0.000 abstract 2
- 230000007797 corrosion Effects 0.000 abstract 2
- 238000005260 corrosion Methods 0.000 abstract 2
- 229920003986 novolac Polymers 0.000 abstract 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 abstract 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP763580A JPS56104926A (en) | 1980-01-25 | 1980-01-25 | Epoxy resin composition for sealing electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP763580A JPS56104926A (en) | 1980-01-25 | 1980-01-25 | Epoxy resin composition for sealing electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56104926A true JPS56104926A (en) | 1981-08-21 |
| JPS6136772B2 JPS6136772B2 (enrdf_load_stackoverflow) | 1986-08-20 |
Family
ID=11671280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP763580A Granted JPS56104926A (en) | 1980-01-25 | 1980-01-25 | Epoxy resin composition for sealing electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56104926A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6259660A (ja) * | 1985-09-11 | 1987-03-16 | Japan Synthetic Rubber Co Ltd | フエノ−ル樹脂組成物 |
| WO2022043421A1 (en) * | 2020-08-28 | 2022-03-03 | Basf Coatings Gmbh | Solvent-borne, two-pack, anticorrosion coating composition |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6360775U (enrdf_load_stackoverflow) * | 1986-10-09 | 1988-04-22 |
-
1980
- 1980-01-25 JP JP763580A patent/JPS56104926A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6259660A (ja) * | 1985-09-11 | 1987-03-16 | Japan Synthetic Rubber Co Ltd | フエノ−ル樹脂組成物 |
| WO2022043421A1 (en) * | 2020-08-28 | 2022-03-03 | Basf Coatings Gmbh | Solvent-borne, two-pack, anticorrosion coating composition |
| CN115989092A (zh) * | 2020-08-28 | 2023-04-18 | 巴斯夫涂料有限公司 | 溶剂性双包装防腐涂料组合物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6136772B2 (enrdf_load_stackoverflow) | 1986-08-20 |
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